| Presentation | 2016-01-28 A Study of the Crosstalk and the High-Density Package of the Single-ended Transmission Line Takashi Kuwahara, Yoshihiro Akeboshi, Seiichi Saito, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | With improvement in the speed of digital equipment in recent years, for example of DDR memory, the number of high-speed single-ended signal transmission line increases abundantly by many lanes in the circuit substrate. And it has been a subject what density growth of the gap between the inside of a signal wire pair or a pair is packed and carried out. Then, writers examined the cross-sectional shape which can reduce the basis of the conditions that signal conductor section area and signal wiring efficiency (occupied area) are certain, and the amount of cross talks by changing the conventional not the oblong form where the neighborhood parallel to a substrate side is long but form for signal wire cross-sectional shape . We report the simulated results and observation result of the prototype circuit board now. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Crosstalk / NEXT / FEXT / Conductor Shape / Single-ended Line / High-Density Package / MSL / Xtalk |
| Paper # | EMCJ2015-110 |
| Date of Issue | 2016-01-21 (EMCJ) |
| Conference Information | |
| Committee | EMCJ / WPT |
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| Conference Date | 2016/1/28(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kumamoto National Colle. Technology |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Communication, Wireless Power Transmission, EMC |
| Chair | Hideaki Sone(Tohoku Univ.) / Naoki Shinohara(Kyoto Univ.) |
| Vice Chair | Osami Wada(Kyoto Univ.) |
| Secretary | Osami Wada(Okayama Univ.) / (Hitachi) |
| Assistant | Atsuhiro Takahashi(Toyota Central R&D Labs.) / Yoshiki Kayano(Akita Univ.) / Yusaku Katsube(Hitachi) / Takashi Hikagae(Hokkaido Univ.) / Tsunayuki Yamamoto(Yamaguchi Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Electromagnetic Compatibility / Technical Committee on Wireless Power Transfer |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Study of the Crosstalk and the High-Density Package of the Single-ended Transmission Line |
| Sub Title (in English) | |
| Keyword(1) | Crosstalk |
| Keyword(2) | NEXT |
| Keyword(3) | FEXT |
| Keyword(4) | Conductor Shape |
| Keyword(5) | Single-ended Line |
| Keyword(6) | High-Density Package |
| Keyword(7) | MSL |
| Keyword(8) | Xtalk |
| 1st Author's Name | Takashi Kuwahara |
| 1st Author's Affiliation | Mitsubishi Electric Corporation(MitsubishiElectric) |
| 2nd Author's Name | Yoshihiro Akeboshi |
| 2nd Author's Affiliation | Mitsubishi Electric Corporation(MitsubishiElectric) |
| 3rd Author's Name | Seiichi Saito |
| 3rd Author's Affiliation | Salesian Polytechnic(Salesian Polytechnic) |
| Date | 2016-01-28 |
| Paper # | EMCJ2015-110 |
| Volume (vol) | vol.115 |
| Number (no) | EMCJ-427 |
| Page | pp.pp.37-42(EMCJ), |
| #Pages | 6 |
| Date of Issue | 2016-01-21 (EMCJ) |