Presentation 2015-12-18
Development of the Geometry of a Heat sink for Improving Heat Transfer
Shinichi Tomiyama,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The heat release system is important for assuring performance, safety, and life of electronic devices. A heat sink and a forced air cooling system using fan is one of the heat release system. However bottom of a heat sink and surround electronic devices is low wind speed. So this system cannot solve the heat release problems in electronic devices. We developed a heat sink for speed up wind velocity of bottom of a heat sink and surround electronic devices. The result of temperature measurement, The proposed method suppressed the temperature rise of electronic devices of 3–11% than the conventional method. In this paper, We proposed heat sink about design policy.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Heat sink / Forced air cooling / Radiation Performance / Thermal-Flow Simulation
Paper # DC2015-73
Date of Issue 2015-12-11 (DC)

Conference Information
Committee DC
Conference Date 2015/12/18(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Kurieito Mulakami (Murakami City)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Nobuyasu Kanekawa(Hitachi)
Vice Chair Michiko Inoue(NAIST)
Secretary Michiko Inoue(RTRI)

Paper Information
Registration To Technical Committee on Dependable Computing
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of the Geometry of a Heat sink for Improving Heat Transfer
Sub Title (in English)
Keyword(1) Heat sink
Keyword(2) Forced air cooling
Keyword(3) Radiation Performance
Keyword(4) Thermal-Flow Simulation
1st Author's Name Shinichi Tomiyama
1st Author's Affiliation Tokyo Metropolitan Technology Research Institute(TIRI)
Date 2015-12-18
Paper # DC2015-73
Volume (vol) vol.115
Number (no) DC-382
Page pp.pp.1-4(DC),
#Pages 4
Date of Issue 2015-12-11 (DC)