Presentation | 2015-12-03 Construction and Evaluation of Three-Dimensional Heat Transfer Simulator for LSI Packages Shougo Watanabe, Takashi Omura, Yuki Kitagawa, Lei Lin, Lin Meng, Masahiro Fukui, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | In this study, we consider the thermal distribution in three-dimensional, and we tried the efficiency of analytical calculation of the three-dimensional circuit using GPU. As a result, we have achieved improving the accuracy of analyzing the three-dimensional thermal transfer. Furthermore, we have achieved about 22.8 times speed-up than a CPU program while accelerating the speed of calculation by using GPU parallel computing. In this paper, we introduce heat transfer coefficient into our simulator to consider convection. And we compare our analysis results with the test results and another analysis results, and verify the accuracy of our simulation. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | GPU / thermal analysis / heat transfer |
Paper # | VLD2015-64,DC2015-60 |
Date of Issue | 2015-11-24 (VLD, DC) |
Conference Information | |
Committee | VLD / DC / IPSJ-SLDM / CPSY / RECONF / ICD / CPM |
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Conference Date | 2015/12/1(3days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Nagasaki Kinro Fukushi Kaikan |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Design Gaia 2015 -New Field of VLSI Design- |
Chair | Yusuke Matsunaga(Kyushu Univ.) / Nobuyasu Kanekawa(Hitachi) / Masahiro Fukui(Ritsumeikan Univ.) / Yasuhiko Nakashima(NAIST) / Minoru Watanabe(Shizuoka Univ.) / Minoru Fujishima(Hiroshima Univ.) / Satoru Noge(Numazu National College of Tech.) |
Vice Chair | Takashi Takenana(NEC) / Michiko Inoue(NAIST) / / Koji Nakano(Hiroshima Univ.) / Hidetsugu Irie(Univ. of Tokyo) / Masato Motomura(Hokkaido Univ.) / Yuichiro Shibata(Nagasaki Univ.) / Hideto Hidaka(Renesas) / Fumihiko Hirose(Yamagata Univ.) |
Secretary | Takashi Takenana(Ritsumeikan Univ.) / Michiko Inoue(Fujitsu Labs.) / (RTRI) / Koji Nakano(Kyoto Sangyo Univ.) / Hidetsugu Irie(Sharp) / Masato Motomura(Kitakyushu City Univ.) / Yuichiro Shibata(Toshiba) / Hideto Hidaka(Fujitsu Labs.) / Fumihiko Hirose(NII) |
Assistant | Ittetsu Taniguchi(Ritsumeikan Univ.) / / / Shinya Takameda(NAIST) / Takeshi Ohkawa(Utsunomiya Univ.) / Kazuya Tanikagawa(Hiroshima City Univ.) / Takefumi Miyoshi(e-trees.Japan) / Makoto Takamiya(Univ. of Tokyo) / Hiroe Iwasaki(NTT) / Takashi Hashimoto(Panasonic) / Hiroyuki Ito(Tokyo Inst. of Tech.) / Pham Konkuha(Univ. of Electro-Comm.) / Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) |
Paper Information | |
Registration To | Technical Committee on VLSI Design Technologies / Technical Committee on Dependable Computing / Special Interest Group on System and LSI Design Methodology / Technical Committee on Computer Systems / Technical Committee on Reconfigurable Systems / Technical Committee on Integrated Circuits and Devices / Technical Committee on Component Parts and Materials |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Construction and Evaluation of Three-Dimensional Heat Transfer Simulator for LSI Packages |
Sub Title (in English) | |
Keyword(1) | GPU |
Keyword(2) | thermal analysis |
Keyword(3) | heat transfer |
1st Author's Name | Shougo Watanabe |
1st Author's Affiliation | Ritsumeikan University(Ritsumeikan Univ.) |
2nd Author's Name | Takashi Omura |
2nd Author's Affiliation | Ritsumeikan University(Ritsumeikan Univ.) |
3rd Author's Name | Yuki Kitagawa |
3rd Author's Affiliation | Ritsumeikan University(Ritsumeikan Univ.) |
4th Author's Name | Lei Lin |
4th Author's Affiliation | Ritsumeikan University(Ritsumeikan Univ.) |
5th Author's Name | Lin Meng |
5th Author's Affiliation | Ritsumeikan University(Ritsumeikan Univ.) |
6th Author's Name | Masahiro Fukui |
6th Author's Affiliation | Ritsumeikan University(Ritsumeikan Univ.) |
Date | 2015-12-03 |
Paper # | VLD2015-64,DC2015-60 |
Volume (vol) | vol.115 |
Number (no) | VLD-338,DC-339 |
Page | pp.pp.171-176(VLD), pp.171-176(DC), |
#Pages | 6 |
Date of Issue | 2015-11-24 (VLD, DC) |