Presentation 2015-12-03
Construction and Evaluation of Three-Dimensional Heat Transfer Simulator for LSI Packages
Shougo Watanabe, Takashi Omura, Yuki Kitagawa, Lei Lin, Lin Meng, Masahiro Fukui,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) In this study, we consider the thermal distribution in three-dimensional, and we tried the efficiency of analytical calculation of the three-dimensional circuit using GPU. As a result, we have achieved improving the accuracy of analyzing the three-dimensional thermal transfer. Furthermore, we have achieved about 22.8 times speed-up than a CPU program while accelerating the speed of calculation by using GPU parallel computing. In this paper, we introduce heat transfer coefficient into our simulator to consider convection. And we compare our analysis results with the test results and another analysis results, and verify the accuracy of our simulation.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) GPU / thermal analysis / heat transfer
Paper # VLD2015-64,DC2015-60
Date of Issue 2015-11-24 (VLD, DC)

Conference Information
Committee VLD / DC / IPSJ-SLDM / CPSY / RECONF / ICD / CPM
Conference Date 2015/12/1(3days)
Place (in Japanese) (See Japanese page)
Place (in English) Nagasaki Kinro Fukushi Kaikan
Topics (in Japanese) (See Japanese page)
Topics (in English) Design Gaia 2015 -New Field of VLSI Design-
Chair Yusuke Matsunaga(Kyushu Univ.) / Nobuyasu Kanekawa(Hitachi) / Masahiro Fukui(Ritsumeikan Univ.) / Yasuhiko Nakashima(NAIST) / Minoru Watanabe(Shizuoka Univ.) / Minoru Fujishima(Hiroshima Univ.) / Satoru Noge(Numazu National College of Tech.)
Vice Chair Takashi Takenana(NEC) / Michiko Inoue(NAIST) / / Koji Nakano(Hiroshima Univ.) / Hidetsugu Irie(Univ. of Tokyo) / Masato Motomura(Hokkaido Univ.) / Yuichiro Shibata(Nagasaki Univ.) / Hideto Hidaka(Renesas) / Fumihiko Hirose(Yamagata Univ.)
Secretary Takashi Takenana(Ritsumeikan Univ.) / Michiko Inoue(Fujitsu Labs.) / (RTRI) / Koji Nakano(Kyoto Sangyo Univ.) / Hidetsugu Irie(Sharp) / Masato Motomura(Kitakyushu City Univ.) / Yuichiro Shibata(Toshiba) / Hideto Hidaka(Fujitsu Labs.) / Fumihiko Hirose(NII)
Assistant Ittetsu Taniguchi(Ritsumeikan Univ.) / / / Shinya Takameda(NAIST) / Takeshi Ohkawa(Utsunomiya Univ.) / Kazuya Tanikagawa(Hiroshima City Univ.) / Takefumi Miyoshi(e-trees.Japan) / Makoto Takamiya(Univ. of Tokyo) / Hiroe Iwasaki(NTT) / Takashi Hashimoto(Panasonic) / Hiroyuki Ito(Tokyo Inst. of Tech.) / Pham Konkuha(Univ. of Electro-Comm.) / Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.)

Paper Information
Registration To Technical Committee on VLSI Design Technologies / Technical Committee on Dependable Computing / Special Interest Group on System and LSI Design Methodology / Technical Committee on Computer Systems / Technical Committee on Reconfigurable Systems / Technical Committee on Integrated Circuits and Devices / Technical Committee on Component Parts and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Construction and Evaluation of Three-Dimensional Heat Transfer Simulator for LSI Packages
Sub Title (in English)
Keyword(1) GPU
Keyword(2) thermal analysis
Keyword(3) heat transfer
1st Author's Name Shougo Watanabe
1st Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
2nd Author's Name Takashi Omura
2nd Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
3rd Author's Name Yuki Kitagawa
3rd Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
4th Author's Name Lei Lin
4th Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
5th Author's Name Lin Meng
5th Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
6th Author's Name Masahiro Fukui
6th Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
Date 2015-12-03
Paper # VLD2015-64,DC2015-60
Volume (vol) vol.115
Number (no) VLD-338,DC-339
Page pp.pp.171-176(VLD), pp.171-176(DC),
#Pages 6
Date of Issue 2015-11-24 (VLD, DC)