| Presentation | 2015-11-13 Design and Implementation of a Wireless Temperature/Humidity Sensor Enabling Measurement of Thermal Environment in Food Processing Oven Tetsuo Tsujioka, Akihiro Morikawa, Kazuma Kodama, Hiroyuki Iyota, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The authors have studied temperature/humidity measurement devices even in ovens at high temperature such as over 200 degrees Celsius. In this paper, we introduce a new sensor device (measurement device) for dry-bulb and wet-bulb temperatures in addition to radiation heat, libration (acceleration) and pressure. The sensor device has many advantages of reduced size, wireless and heat resistance structure, and then it enables a real-time measurement of thermal environment in food processing oven. An experimental result is also reported and evaluated. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Thermal engineering / Food engineering / Thermocouple / Oven / Thermal environment |
| Paper # | CS2015-56 |
| Date of Issue | 2015-11-05 (CS) |
| Conference Information | |
| Committee | CS |
|---|---|
| Conference Date | 2015/11/12(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Hotel Taisetsu (Sounkyo Spa, Hokkaido) |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Broadband Access Systems, Home Networks, Network Services, Applications for Communications, etc. |
| Chair | Toshinori Tsuboi(Tokyo Univ. of Tech.) |
| Vice Chair | Tetsuya Yokotani(Kanazawa Inst. of Tech.) |
| Secretary | Tetsuya Yokotani(Hiroshima City Univ.) |
| Assistant | |
| Paper Information | |
| Registration To | Technical Committee on Communication Systems |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Design and Implementation of a Wireless Temperature/Humidity Sensor Enabling Measurement of Thermal Environment in Food Processing Oven |
| Sub Title (in English) | |
| Keyword(1) | Thermal engineering |
| Keyword(2) | Food engineering |
| Keyword(3) | Thermocouple |
| Keyword(4) | Oven |
| Keyword(5) | Thermal environment |
| 1st Author's Name | Tetsuo Tsujioka |
| 1st Author's Affiliation | Osaka City University(Osaka City Univ.) |
| 2nd Author's Name | Akihiro Morikawa |
| 2nd Author's Affiliation | Osaka City University(Osaka City Univ.) |
| 3rd Author's Name | Kazuma Kodama |
| 3rd Author's Affiliation | Osaka City University(Osaka City Univ.) |
| 4th Author's Name | Hiroyuki Iyota |
| 4th Author's Affiliation | Osaka City University(Osaka City Univ.) |
| Date | 2015-11-13 |
| Paper # | CS2015-56 |
| Volume (vol) | vol.115 |
| Number (no) | CS-304 |
| Page | pp.pp.65-69(CS), |
| #Pages | 5 |
| Date of Issue | 2015-11-05 (CS) |