Presentation | 2015-11-27 Evaluation of the bonding interface of multi-junction solar cell according to smart stack technology Shoichiro Nonaka, Akio Furukawa, Kikuo Makita, Hidenori Mizuno, Takeyoshi Sugaya, Shigeru Niki, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Multi-junction solar cell have high efficiency with the combination of different cells. We developed new fabrication method, “Smart Stacking Technology”, which integrates Pd nanoparticles at the bonding interfaces. Using this technology, a GaAs/InP 4-junction solar cell with 31.6% efficiency and a GaAs/CuInGaSe 3-junction solar cell with 24.2% efficiency have been reported. In this paper, we focus on bonding resistance to gain knowledge of “Smart Stacking Technology” and examine the mechanism of reducing bonding resistance. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Multi-junction solar cells / Junction resistance / Bonding technology / Nanoparticle / GaAs / Pd |
Paper # | ED2015-88,CPM2015-123,LQE2015-120 |
Date of Issue | 2015-11-19 (ED, CPM, LQE) |
Conference Information | |
Committee | ED / LQE / CPM |
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Conference Date | 2015/11/26(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Osaka City University Media Center |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Nitride Semiconductor Devices, Materials, Related Technologies |
Chair | Koichi Maezawa(Univ. of Toyama) / Hajime Shoji(Sumitomo Electric Industries) / Satoru Noge(Numazu National College of Tech.) |
Vice Chair | Kunio Tsuda(Toshiba) / Susumu Noda(Kyoto Univ.) / Fumihiko Hirose(Yamagata Univ.) |
Secretary | Kunio Tsuda(NEC) / Susumu Noda(JAIST) / Fumihiko Hirose(NICT) |
Assistant | Manabu Arai(New JRC) / Masataka Higashiwaki(NICT) / / Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) |
Paper Information | |
Registration To | Technical Committee on Electron Device / Technical Committee on Lasers and Quantum Electronics / Technical Committee on Component Parts and Materials |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Evaluation of the bonding interface of multi-junction solar cell according to smart stack technology |
Sub Title (in English) | |
Keyword(1) | Multi-junction solar cells |
Keyword(2) | Junction resistance |
Keyword(3) | Bonding technology |
Keyword(4) | Nanoparticle |
Keyword(5) | GaAs |
Keyword(6) | Pd |
1st Author's Name | Shoichiro Nonaka |
1st Author's Affiliation | Tokyo University of Science(Tokyo Univ. of Science) |
2nd Author's Name | Akio Furukawa |
2nd Author's Affiliation | Tokyo University of Science(Tokyo Univ. of Science) |
3rd Author's Name | Kikuo Makita |
3rd Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
4th Author's Name | Hidenori Mizuno |
4th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
5th Author's Name | Takeyoshi Sugaya |
5th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
6th Author's Name | Shigeru Niki |
6th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
Date | 2015-11-27 |
Paper # | ED2015-88,CPM2015-123,LQE2015-120 |
Volume (vol) | vol.115 |
Number (no) | ED-329,CPM-330,LQE-331 |
Page | pp.pp.101-104(ED), pp.101-104(CPM), pp.101-104(LQE), |
#Pages | 4 |
Date of Issue | 2015-11-19 (ED, CPM, LQE) |