Presentation 2015-08-27
[Invited Talk] Heterogeneous Integration Technology Using Fluidic Self Assembly Based on Ga Molten Bumps
Koichi Maezawa, Jun Nakano, Tomoaki Shibata, Hiroki Morita, Hiroshi Sakamoto, Satoshi Yamada, Masayuki Mori,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Fluidic Self Assembly (FSA) is a most promising heterogeneous integration technique leading to new applications of semiconductor devices. The FSA is a highly exible technique, where scattered small device blocks are arranged into the recesses on the host substrate placed in fluid. Recently, we proposed a novele FSA employing capillary force of the molten Ga bumps. In this paper, we describe the features, applications, and the reliablity of the FSA based on our research. Moreover, application of this technique to micro/millimeter wave integrated circuits is discussed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) heterogeneous integration / InP / InGaAs / uidic self assembly / resonant tunneling diode
Paper # R2015-28,EMD2015-36,CPM2015-52,OPE2015-67,LQE2015-36
Date of Issue 2015-08-20 (R, EMD, CPM, OPE, LQE)

Conference Information
Committee CPM / OPE / LQE / R / EMD
Conference Date 2015/8/27(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Aomori-Bussankan-Asupamu
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Satoru Noge(Numazu National College of Tech.) / Hiroyuki Uenohara(Tokyo Inst. of Tech.) / Hajime Shoji(Sumitomo Electric Industries) / Hiroyasu Mawatari(NTT) / Junya Sekikawa(Shizuoka Univ.)
Vice Chair Fumihiko Hirose(Yamagata Univ.) / Kensuke Ogawa(Fujikura) / Susumu Noda(Kyoto Univ.) / Tetsushi Yuge(National Defense Academy) / Yoshiteru Abe(NTT)
Secretary Fumihiko Hirose(NTT) / Kensuke Ogawa(Nihon Univ.) / Susumu Noda(Fujitsu Labs.) / Tetsushi Yuge(NTT) / Yoshiteru Abe(NICT)
Assistant Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) / Takaaki Ishigure(Keio Univ.) / Eiji Yagyu(Mitsubishi Electric) / / Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.) / Shinichi Wada(TMC system)

Paper Information
Registration To Technical Committee on Component Parts and Materials / Technical Committee on Optoelectronics / Technical Committee on Lasers and Quantum Electronics / Technical Committee on Reliability / Technical Committee on Electromechanical Devices
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] Heterogeneous Integration Technology Using Fluidic Self Assembly Based on Ga Molten Bumps
Sub Title (in English)
Keyword(1) heterogeneous integration
Keyword(2) InP
Keyword(3) InGaAs
Keyword(4) uidic self assembly
Keyword(5) resonant tunneling diode
1st Author's Name Koichi Maezawa
1st Author's Affiliation University of Toyama(Univ. Toyama)
2nd Author's Name Jun Nakano
2nd Author's Affiliation University of Toyama(Univ. Toyama)
3rd Author's Name Tomoaki Shibata
3rd Author's Affiliation University of Toyama(Univ. Toyama)
4th Author's Name Hiroki Morita
4th Author's Affiliation University of Toyama(Univ. Toyama)
5th Author's Name Hiroshi Sakamoto
5th Author's Affiliation University of Toyama(Univ. Toyama)
6th Author's Name Satoshi Yamada
6th Author's Affiliation University of Toyama(Univ. Toyama)
7th Author's Name Masayuki Mori
7th Author's Affiliation University of Toyama(Univ. Toyama)
Date 2015-08-27
Paper # R2015-28,EMD2015-36,CPM2015-52,OPE2015-67,LQE2015-36
Volume (vol) vol.115
Number (no) R-194,EMD-195,CPM-196,OPE-197,LQE-198
Page pp.pp.27-32(R), pp.27-32(EMD), pp.27-32(CPM), pp.27-32(OPE), pp.27-32(LQE),
#Pages 6
Date of Issue 2015-08-20 (R, EMD, CPM, OPE, LQE)