| Presentation | 2015-08-27 [Invited Talk] Heterogeneous Integration Technology Using Fluidic Self Assembly Based on Ga Molten Bumps Koichi Maezawa, Jun Nakano, Tomoaki Shibata, Hiroki Morita, Hiroshi Sakamoto, Satoshi Yamada, Masayuki Mori, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Fluidic Self Assembly (FSA) is a most promising heterogeneous integration technique leading to new applications of semiconductor devices. The FSA is a highly exible technique, where scattered small device blocks are arranged into the recesses on the host substrate placed in fluid. Recently, we proposed a novele FSA employing capillary force of the molten Ga bumps. In this paper, we describe the features, applications, and the reliablity of the FSA based on our research. Moreover, application of this technique to micro/millimeter wave integrated circuits is discussed. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | heterogeneous integration / InP / InGaAs / uidic self assembly / resonant tunneling diode |
| Paper # | R2015-28,EMD2015-36,CPM2015-52,OPE2015-67,LQE2015-36 |
| Date of Issue | 2015-08-20 (R, EMD, CPM, OPE, LQE) |
| Conference Information | |
| Committee | CPM / OPE / LQE / R / EMD |
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| Conference Date | 2015/8/27(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Aomori-Bussankan-Asupamu |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Satoru Noge(Numazu National College of Tech.) / Hiroyuki Uenohara(Tokyo Inst. of Tech.) / Hajime Shoji(Sumitomo Electric Industries) / Hiroyasu Mawatari(NTT) / Junya Sekikawa(Shizuoka Univ.) |
| Vice Chair | Fumihiko Hirose(Yamagata Univ.) / Kensuke Ogawa(Fujikura) / Susumu Noda(Kyoto Univ.) / Tetsushi Yuge(National Defense Academy) / Yoshiteru Abe(NTT) |
| Secretary | Fumihiko Hirose(NTT) / Kensuke Ogawa(Nihon Univ.) / Susumu Noda(Fujitsu Labs.) / Tetsushi Yuge(NTT) / Yoshiteru Abe(NICT) |
| Assistant | Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) / Takaaki Ishigure(Keio Univ.) / Eiji Yagyu(Mitsubishi Electric) / / Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.) / Shinichi Wada(TMC system) |
| Paper Information | |
| Registration To | Technical Committee on Component Parts and Materials / Technical Committee on Optoelectronics / Technical Committee on Lasers and Quantum Electronics / Technical Committee on Reliability / Technical Committee on Electromechanical Devices |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Heterogeneous Integration Technology Using Fluidic Self Assembly Based on Ga Molten Bumps |
| Sub Title (in English) | |
| Keyword(1) | heterogeneous integration |
| Keyword(2) | InP |
| Keyword(3) | InGaAs |
| Keyword(4) | uidic self assembly |
| Keyword(5) | resonant tunneling diode |
| 1st Author's Name | Koichi Maezawa |
| 1st Author's Affiliation | University of Toyama(Univ. Toyama) |
| 2nd Author's Name | Jun Nakano |
| 2nd Author's Affiliation | University of Toyama(Univ. Toyama) |
| 3rd Author's Name | Tomoaki Shibata |
| 3rd Author's Affiliation | University of Toyama(Univ. Toyama) |
| 4th Author's Name | Hiroki Morita |
| 4th Author's Affiliation | University of Toyama(Univ. Toyama) |
| 5th Author's Name | Hiroshi Sakamoto |
| 5th Author's Affiliation | University of Toyama(Univ. Toyama) |
| 6th Author's Name | Satoshi Yamada |
| 6th Author's Affiliation | University of Toyama(Univ. Toyama) |
| 7th Author's Name | Masayuki Mori |
| 7th Author's Affiliation | University of Toyama(Univ. Toyama) |
| Date | 2015-08-27 |
| Paper # | R2015-28,EMD2015-36,CPM2015-52,OPE2015-67,LQE2015-36 |
| Volume (vol) | vol.115 |
| Number (no) | R-194,EMD-195,CPM-196,OPE-197,LQE-198 |
| Page | pp.pp.27-32(R), pp.27-32(EMD), pp.27-32(CPM), pp.27-32(OPE), pp.27-32(LQE), |
| #Pages | 6 |
| Date of Issue | 2015-08-20 (R, EMD, CPM, OPE, LQE) |