| Presentation | 2015-07-16 RFIC Flip-Chip Interconnection Using a Fiber Type Anisotropic Conductive Film Takeo Owada, Mizuki Motoyoshi, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | RFIC flip-chip mounting technique is important to realize compact and high-performance transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and needs complicated process including formation and flattening of the Au bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF). This flip chip mounting process was developed for low frequency IC’s having large umber I/O pins and does not require the bump bonding and flattening process. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images and the RF performance is measured and compared with conventional Au SBB. The measured result shows the inferior performance to Au SBB, but it shows return loss of more than 10dB below frequency of 4.2GHz. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | flip chip / microwave / packaging / RFIC / anisotropic conductive film |
| Paper # | EMT2015-14,MW2015-52,OPE2015-26,EST2015-18,MWP2015-17 |
| Date of Issue | 2015-07-09 (EMT, MW, OPE, EST, MWP) |
| Conference Information | |
| Committee | EMT / MW / OPE / MWP / EST / IEE-EMT |
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| Conference Date | 2015/7/16(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kushiro City Lifelong Learning Center |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Light wave & Electromagnetic Wave Workshop |
| Chair | Motoyuki Sato(Tohoku Univ.) / Yohei Ishikawa(Kyoto Univ.) / Hiroyuki Uenohara(Tokyo Inst. of Tech.) / Yuichi Kado(Kyoto Inst. of Tech.) / Tatsuya Kashiwa(Kitami Inst. of Tech.) / Masahiro Tanaka(Gifu Univ.) |
| Vice Chair | Akira Hirose(Univ. of Tokyo) / Masashi Nakatsugawa(NTT) / Takao Kuki(Kokushikan Univ.) / Kenjiro Nishikawa(Kagoshima Univ.) / Kensuke Ogawa(Fujikura) / Tetsuya Kawanishi(NICT) / Hiroyuki Toda(Doshisha Univ.) / Hideaki Kimura(NTT) / Akimasa Hirata(Nagoya Inst. of Tech.) / Shinichiro Ohnuki(Nihon Univ.) |
| Secretary | Akira Hirose(Niigata Univ.) / Masashi Nakatsugawa(Mitsubishi Electric) / Takao Kuki(NTT) / Kenjiro Nishikawa(Panasonic) / Kensuke Ogawa(Fujitsu Labs.) / Tetsuya Kawanishi(NTT) / Hiroyuki Toda(ENRI) / Hideaki Kimura(NTT) / Akimasa Hirata(Tokyo Inst. of Tech.) / Shinichiro Ohnuki(Muroran Inst. of Tech.) / (NDA) |
| Assistant | Kazunori Takahashi(Tohoku Univ.) / Ryo Ishikawa(Univ. of Electro-Comm.) / Naoto Sekiya(Univ. of Yamanashi) / Takaaki Ishigure(Keio Univ.) / Eiji Yagyu(Mitsubishi Electric) / Kensuke Ikeda(CRIEPI) / Atsushi Kanno(NICT) / Atsushi Kezuka(ENRI) / Kenji Taguchi(Kitami Inst. of Tech.) / Yoshihiro Naka(KUHW) |
| Paper Information | |
| Registration To | Technical Committee on Electromagnetic Theory / Technical Committee on Microwaves / Technical Committee on Optoelectronics / Technical Committee on Microwave and Millimeter-wave Photonics / Technical Committee on Electronics Simulation Technology / Technical Meeting on Electromagnetic Theory |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | RFIC Flip-Chip Interconnection Using a Fiber Type Anisotropic Conductive Film |
| Sub Title (in English) | |
| Keyword(1) | flip chip |
| Keyword(2) | microwave |
| Keyword(3) | packaging |
| Keyword(4) | RFIC |
| Keyword(5) | anisotropic conductive film |
| 1st Author's Name | Takeo Owada |
| 1st Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 2nd Author's Name | Mizuki Motoyoshi |
| 2nd Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 3rd Author's Name | Suguru Kameda |
| 3rd Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 4th Author's Name | Noriharu Suematsu |
| 4th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 5th Author's Name | Tadashi Takagi |
| 5th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 6th Author's Name | Kazuo Tsubouchi |
| 6th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| Date | 2015-07-16 |
| Paper # | EMT2015-14,MW2015-52,OPE2015-26,EST2015-18,MWP2015-17 |
| Volume (vol) | vol.115 |
| Number (no) | EMT-141,MW-142,OPE-143,EST-144,MWP-145 |
| Page | pp.pp.35-39(EMT), pp.35-39(MW), pp.35-39(OPE), pp.35-39(EST), pp.35-39(MWP), |
| #Pages | 5 |
| Date of Issue | 2015-07-09 (EMT, MW, OPE, EST, MWP) |