| Presentation | 2015-06-19 Evaluation of the third Flex Power FPGA chip in SOTB technology Masakazu Hioki, Yasuhiro Ogasahara, Hanpei Koike, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper reports the evaluation of the third Flex Power FPGA chip in SOTB technology. Fabricated chip aims to shrink an FPGA tile footprint. 2.25 times FPGA tiles can be integrated compared to previously fabricated chip by reducing design margins and by redesigning back bias circuits. Moreover, power reduction efficiency of fabricated chip is referred in case that a 32bit binary counter circuit is implemented. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Silicon On Thin BOX / SOTB / Flex Power FPGA / FPGA |
| Paper # | RECONF2015-3 |
| Date of Issue | 2015-06-12 (RECONF) |
| Conference Information | |
| Committee | RECONF |
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| Conference Date | 2015/6/19(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kyoto University |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | the 10th anniversary celebration of RECONF: Reconfigurable Systems, etc. |
| Chair | Minoru Watanabe(Shizuoka Univ.) |
| Vice Chair | Masato Motomura(Hokkaido Univ.) / Yuichiro Shibata(Nagasaki Univ.) |
| Secretary | Masato Motomura(Toshiba) / Yuichiro Shibata(Univ. of Tsukuba) |
| Assistant | Kazuya Tanikagawa(Hiroshima City Univ.) / Takefumi Miyoshi(e-trees.Japan) |
| Paper Information | |
| Registration To | Technical Committee on Reconfigurable Systems |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Evaluation of the third Flex Power FPGA chip in SOTB technology |
| Sub Title (in English) | |
| Keyword(1) | Silicon On Thin BOX |
| Keyword(2) | SOTB |
| Keyword(3) | Flex Power FPGA |
| Keyword(4) | FPGA |
| 1st Author's Name | Masakazu Hioki |
| 1st Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| 2nd Author's Name | Yasuhiro Ogasahara |
| 2nd Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| 3rd Author's Name | Hanpei Koike |
| 3rd Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| Date | 2015-06-19 |
| Paper # | RECONF2015-3 |
| Volume (vol) | vol.115 |
| Number (no) | RECONF-109 |
| Page | pp.pp.13-16(RECONF), |
| #Pages | 4 |
| Date of Issue | 2015-06-12 (RECONF) |