| Presentation | 2015-04-29 Low Coefficient of Thermal Expansion Polyimide Film for Flexible Device Substrate. Tetsuo Okuyama, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
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| Date of Issue |
| Conference Information | |
| Committee | OME / SDM |
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| Conference Date | 2015/4/29(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Oh-hama Nobumoto Memorial Hall |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Thin FIlms, Functional Electronics Devices, New Functional Materials and Evaluation, BIomtechnology |
| Chair | Keizo Kato(Niigata Univ.) / Yuzou Oono(Univ. of Tsukuba) |
| Vice Chair | Naoki Matsuda(AIST) / Tatsuya Kunikiyo(Renesas) |
| Secretary | Naoki Matsuda(Canon Electronics) / Tatsuya Kunikiyo(Aichi Inst. of Tech.) |
| Assistant | Akihiro Kohno(NTT) / Shinichiro Inoue(NICT) / Tadashi Yamaguchi(Renesas) |
| Paper Information | |
| Registration To | Technical Committee on Organic Molecular Electronics / Technical Committee on Silicon Device and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Low Coefficient of Thermal Expansion Polyimide Film for Flexible Device Substrate. |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Tetsuo Okuyama |
| 1st Author's Affiliation | TOYOBO Co., LTD. Research Center(TOYOBO) |
| Date | 2015-04-29 |
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| Volume (vol) | vol.115 |
| Number (no) | SDM-18,OME-19 |
| Page | pp.pp.-(), |
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