| Presentation | 2024-02-21 [Invited Talk] Metallization and CMOS Directly Bonded to Array (CBA) Technology for 3D Flash Memory Masayoshi Tagami, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | SDM2023-86 |
| Date of Issue | 2024-02-14 (SDM) |
| Conference Information | |
| Committee | SDM |
|---|---|
| Conference Date | 2024/2/21(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tokyo University-Hongo-Engineering Bldg.4 |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
| Vice Chair | Tatsuya Usami(Rapidus) |
| Secretary | Tatsuya Usami(Tohoku Univ.) |
| Assistant | Takuji Hosoi(Kwansei Gakuin Univ.) / Takuya Futase(Western Digital) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Metallization and CMOS Directly Bonded to Array (CBA) Technology for 3D Flash Memory |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Masayoshi Tagami |
| 1st Author's Affiliation | KIOXIA Corporation(KIOXIA) |
| Date | 2024-02-21 |
| Paper # | SDM2023-86 |
| Volume (vol) | vol.123 |
| Number (no) | SDM-385 |
| Page | pp.pp.27-30(SDM), |
| #Pages | 4 |
| Date of Issue | 2024-02-14 (SDM) |