| Presentation | 2024-01-31 [Invited Talk] CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory Masayoshi Tagami, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | 3D stacked devices have been developed and manufactured to realize gains in power, performance, area and cost (PPAC) in various devices. In this work, CMOS directly bonded to array (CBA) technology is applied to 3D flash memory. As a result, CMOS and cell performance can be improved, and further 2D and 3D scaling can be achieved. CBA technology is essential to realize PPAC goals for future 3D flash memory. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | 3D stacked device / PPAC / Cu direct bonding / 3D flash memory |
| Paper # | SDM2023-76 |
| Date of Issue | 2024-01-24 (SDM) |
| Conference Information | |
| Committee | SDM |
|---|---|
| Conference Date | 2024/1/31(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | KIT Toranomon Graduate School |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Advanced semiconductor devices and processes (Special feature on IEDM) |
| Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
| Vice Chair | Tatsuya Usami(Rapidus) |
| Secretary | Tatsuya Usami(Tohoku Univ.) |
| Assistant | Takuji Hosoi(Kwansei Gakuin Univ.) / Takuya Futase(Western Digital) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory |
| Sub Title (in English) | |
| Keyword(1) | 3D stacked device |
| Keyword(2) | PPAC |
| Keyword(3) | Cu direct bonding |
| Keyword(4) | 3D flash memory |
| 1st Author's Name | Masayoshi Tagami |
| 1st Author's Affiliation | KIOXIA CORPORATION(KIOXIA) |
| Date | 2024-01-31 |
| Paper # | SDM2023-76 |
| Volume (vol) | vol.123 |
| Number (no) | SDM-375 |
| Page | pp.pp.9-12(SDM), |
| #Pages | 4 |
| Date of Issue | 2024-01-24 (SDM) |