| Presentation | 2023-08-24 [Invited Talk] Failure Mode and Analytical Method for Chip Components Akira Saito, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Higher reliability of electric components is demanded with the evolution of AI and the automatic driving. Electric characteristic is the most relevant for the components, but the quality to be able to tolerate stress caused by use environment is necessary. In this report, I describe about the crack in the soldering, tin whisker risk in low temperature soldering, and degradation by the humidity. And I describe about the change of the analytical methods by the miniaturization of components. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Failure analysis / Deflection strength / Tin whisker / ECM / Solder flux / Au/Al junction break |
| Paper # | R2023-25,EMD2023-20,CPM2023-30,OPE2023-69,LQE2023-16 |
| Date of Issue | 2023-08-17 (R, EMD, CPM, OPE, LQE) |
| Conference Information | |
| Committee | LQE / OPE / CPM / EMD / R |
|---|---|
| Conference Date | 2023/8/24(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tohoku university |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Photodetectors, Modulators, Optical Electrical device packaging and reliability |
| Chair | Kosuke Nishimura(KDDI Research) / Taro Arakawa(Yokohama National Univ.) / Hideki Nakazawa(Hirosaki Univ.) / Takahiro Ueno(Nippon Inst. of Tech.) / Yasushi Kadota(Ricoh) |
| Vice Chair | Atsushi Yamaguchi(Kanazawa Inst. of Tech.) / / Tomoaki Terasako(Ehime Univ.) / / Hiroyuki Okamura(Hiroshima Univ.) |
| Secretary | Atsushi Yamaguchi(Fujitsu) / (Yokohama National Univ.) / Tomoaki Terasako(Kanto Gakuin Univ.) / (NTT) / Hiroyuki Okamura(Shinshu Univ.) |
| Assistant | Keita Mochiduki(Yokohama National Univ.) / Takshi Fujisawa(Hokaido Univ.) / Hideyuki Nasu(Furukawa Electric) / Yasuo Kimura(Tokyo Univ. of Tech.) / Fumihiko Hirose(Yamagata Univ.) / Yuichi Nakamura(Toyohashi Univ. of Tech.) / Yoshiki Kayano(Univ. of Electro-Comm.) / Naoki Fukuda(Teikyo Univ.) / Shinji Yokogawa(Univ. of Electro-Comm.) / Takahide Yoshikawa(Fujitsu Lab.) / Shuhei Ota(Kanagawa Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Lasers and Quantum Electronics / Technical Committee on OptoElectronics / Technical Committee on Component Parts and Materials / Technical Committee on Electromechanical Devices / Technical Committee on Reliability |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Failure Mode and Analytical Method for Chip Components |
| Sub Title (in English) | Analysis Example and Correspondence to Miniaturization |
| Keyword(1) | Failure analysis |
| Keyword(2) | Deflection strength |
| Keyword(3) | Tin whisker |
| Keyword(4) | ECM |
| Keyword(5) | Solder flux |
| Keyword(6) | Au/Al junction break |
| 1st Author's Name | Akira Saito |
| 1st Author's Affiliation | Murata manufacturing Co., Ltd.(Murata) |
| Date | 2023-08-24 |
| Paper # | R2023-25,EMD2023-20,CPM2023-30,OPE2023-69,LQE2023-16 |
| Volume (vol) | vol.123 |
| Number (no) | R-158,EMD-159,CPM-160,OPE-161,LQE-162 |
| Page | pp.pp.45-50(R), pp.45-50(EMD), pp.45-50(CPM), pp.45-50(OPE), pp.45-50(LQE), |
| #Pages | 6 |
| Date of Issue | 2023-08-17 (R, EMD, CPM, OPE, LQE) |