| Presentation | 2023-08-25 [Invited Talk] Progress and Future Prospect of Photonic Integrated Devices using InP Chip/SOI Wafer Bonding Technique Hideki Yagi, Nobuhiko Nishiyama, Naoki Fujiwara, Masaki Yanagisawa, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The development of beyond fifth-generation (5G) and sixth-generation (6G) mobile communication systems is accelerating the increase of data traffic, and it is anticipated that a data rate of more than 10 Tbps will be required in one transceiver by 2030. On the other hand, conventional single-material photonic devices supporting optical communication systems seem to have limitations to achieve both high-speed operation and low power dissipation towards 10 Tbps-class data transmission. To overcome this technical challenge, heterogeneous integration which combines the advantages of III-V compound semiconductors and silicon photonics is expected as one of promising approaches. This paper discusses about the progress and future prospect of photonic integrated devices using InP chip/SOI wafer bonding technique. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Heterogeneous integration / Chip-on-wafer direct bonding / InP / Silicon photonics / Wavelength tunable lasers |
| Paper # | R2023-28,EMD2023-23,CPM2023-33,OPE2023-72,LQE2023-19 |
| Date of Issue | 2023-08-17 (R, EMD, CPM, OPE, LQE) |
| Conference Information | |
| Committee | LQE / OPE / CPM / EMD / R |
|---|---|
| Conference Date | 2023/8/24(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tohoku university |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Photodetectors, Modulators, Optical Electrical device packaging and reliability |
| Chair | Kosuke Nishimura(KDDI Research) / Taro Arakawa(Yokohama National Univ.) / Hideki Nakazawa(Hirosaki Univ.) / Takahiro Ueno(Nippon Inst. of Tech.) / Yasushi Kadota(Ricoh) |
| Vice Chair | Atsushi Yamaguchi(Kanazawa Inst. of Tech.) / / Tomoaki Terasako(Ehime Univ.) / / Hiroyuki Okamura(Hiroshima Univ.) |
| Secretary | Atsushi Yamaguchi(Fujitsu) / (Yokohama National Univ.) / Tomoaki Terasako(Kanto Gakuin Univ.) / (NTT) / Hiroyuki Okamura(Shinshu Univ.) |
| Assistant | Keita Mochiduki(Yokohama National Univ.) / Takshi Fujisawa(Hokaido Univ.) / Hideyuki Nasu(Furukawa Electric) / Yasuo Kimura(Tokyo Univ. of Tech.) / Fumihiko Hirose(Yamagata Univ.) / Yuichi Nakamura(Toyohashi Univ. of Tech.) / Yoshiki Kayano(Univ. of Electro-Comm.) / Naoki Fukuda(Teikyo Univ.) / Shinji Yokogawa(Univ. of Electro-Comm.) / Takahide Yoshikawa(Fujitsu Lab.) / Shuhei Ota(Kanagawa Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Lasers and Quantum Electronics / Technical Committee on OptoElectronics / Technical Committee on Component Parts and Materials / Technical Committee on Electromechanical Devices / Technical Committee on Reliability |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Progress and Future Prospect of Photonic Integrated Devices using InP Chip/SOI Wafer Bonding Technique |
| Sub Title (in English) | |
| Keyword(1) | Heterogeneous integration |
| Keyword(2) | Chip-on-wafer direct bonding |
| Keyword(3) | InP |
| Keyword(4) | Silicon photonics |
| Keyword(5) | Wavelength tunable lasers |
| 1st Author's Name | Hideki Yagi |
| 1st Author's Affiliation | Photonics Electronics Technology Research Association(PETRA) |
| 2nd Author's Name | Nobuhiko Nishiyama |
| 2nd Author's Affiliation | Tokyo Institute of Technology(Tokyo Tech) |
| 3rd Author's Name | Naoki Fujiwara |
| 3rd Author's Affiliation | Photonics Electronics Technology Research Association(PETRA) |
| 4th Author's Name | Masaki Yanagisawa |
| 4th Author's Affiliation | Photonics Electronics Technology Research Association(PETRA) |
| Date | 2023-08-25 |
| Paper # | R2023-28,EMD2023-23,CPM2023-33,OPE2023-72,LQE2023-19 |
| Volume (vol) | vol.123 |
| Number (no) | R-158,EMD-159,CPM-160,OPE-161,LQE-162 |
| Page | pp.pp.59-62(R), pp.59-62(EMD), pp.59-62(CPM), pp.59-62(OPE), pp.59-62(LQE), |
| #Pages | 4 |
| Date of Issue | 2023-08-17 (R, EMD, CPM, OPE, LQE) |