| Presentation | 2023-08-01 Evaluation on Flip-Chip Packaging for Quantum Computers at Cryogenic Temperature Misato Taguchi, Ryozo Takahashi, Masako Kato, Nobuhiro Kusuno, Takuji Miki, Makoto Nagata, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Quantum Computers are the most promising technologies to archive more complex calculations. At the same time, much large-number qubits are required to surpasses the performance of classical supercomputers. This paper presents the packaging structure by flip-chip stacking qubit chip on a silicon interposer, which has also interface chips or circuits, for large-scale quantum computer, and the conduction characteristics and cross-sectional structure of flip-chip silicon interposer which was cooled to cryogenic temperature (20 mK ~ 100 mK). Interface chip and silicon interposer were manufactured in 180 nm CMOS process in this work. The interposer was cooled to cryogenic temperature, and we confirmed the conduction via flip-chip stacked interface chip. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Quantum Computer / Flip-Chip Packaging / Silicon Interposer |
| Paper # | SDM2023-37,ICD2023-16 |
| Date of Issue | 2023-07-25 (SDM, ICD) |
| Conference Information | |
| Committee | SDM / ICD / ITE-IST |
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| Conference Date | 2023/8/1(3days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Hokkaido Univ. Multimedia Education Bldg. 3F |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications |
| Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) / Makoto Ikeda(Univ. of Tokyo) / Masayuki Ikebe(Hokkaido Univ.) |
| Vice Chair | Tatsuya Usami(Rapidus) / Hayato Wakabayashi(Sony Semiconductor Solutions) / Takashi Komuro(Saitama Univ.) / Kazuhiro Shimonomura(Ritsmeikan Univ.) / Keiichiro Kagawa(Shizuoka Univ.) |
| Secretary | Tatsuya Usami(Tohoku Univ.) / Hayato Wakabayashi(Panasonic) / Takashi Komuro(Kioxia) / Kazuhiro Shimonomura(Shinshu Univ.) / Keiichiro Kagawa(Tokyo Inst. of Tech.) |
| Assistant | Takuji Hosoi(Kwansei Gakuin Univ.) / Takuya Futase(Western Digital) / Ryo Shirai(Kyoto Univ.) / Jun Shiomi(Osaka Univ.) / Takeshi Kuboki(Sony Semiconductor Solutions) / Junichi Akita(Kanazawa Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials / Technical Committee on Integrated Circuits and Devices / Technical Group on Information Sensing Technologies |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Evaluation on Flip-Chip Packaging for Quantum Computers at Cryogenic Temperature |
| Sub Title (in English) | |
| Keyword(1) | Quantum Computer |
| Keyword(2) | Flip-Chip Packaging |
| Keyword(3) | Silicon Interposer |
| 1st Author's Name | Misato Taguchi |
| 1st Author's Affiliation | Kobe University(Kobe Univ.) |
| 2nd Author's Name | Ryozo Takahashi |
| 2nd Author's Affiliation | Kobe University(Kobe Univ.) |
| 3rd Author's Name | Masako Kato |
| 3rd Author's Affiliation | Hitachi, Ltd(Hitachi, Ltd) |
| 4th Author's Name | Nobuhiro Kusuno |
| 4th Author's Affiliation | Hitachi, Ltd(Hitachi, Ltd) |
| 5th Author's Name | Takuji Miki |
| 5th Author's Affiliation | Kobe University(Kobe Univ.) |
| 6th Author's Name | Makoto Nagata |
| 6th Author's Affiliation | Kobe University(Kobe Univ.) |
| Date | 2023-08-01 |
| Paper # | SDM2023-37,ICD2023-16 |
| Volume (vol) | vol.123 |
| Number (no) | SDM-143,ICD-144 |
| Page | pp.pp.10-13(SDM), pp.10-13(ICD), |
| #Pages | 4 |
| Date of Issue | 2023-07-25 (SDM, ICD) |