Presentation | 2023-07-27 64-ary eigenvalue demodulation employing estimation of the number of eigenvalues within the preset region Kohei Nishida, Yuhei Terashi, Daisuke Hisano, Ken Mishina, Akihiro Maruta, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | |
Paper # | CS2023-18 |
Date of Issue | 2023-07-20 (CS) |
Conference Information | |
Committee | CS |
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Conference Date | 2023/7/27(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Hachijo-machi Chamber of Commerce and Industry |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Next Generation Networks, Access Networks, Broadband Access, Power Line Communications, Wireless Communication Systems, Coding Systems, etc. |
Chair | Daisuke Umehara(Kyoto Inst. of Tech.) |
Vice Chair | Seiji Kozaki(Mitsubishi Electric) |
Secretary | Seiji Kozaki(Chiba Inst. of Tech.) |
Assistant | Hikaru Kawasaki(NICT) / Takeshi Suehiro(Mitsubishi Electric) |
Paper Information | |
Registration To | Technical Committee on Communication Systems |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | 64-ary eigenvalue demodulation employing estimation of the number of eigenvalues within the preset region |
Sub Title (in English) | |
Keyword(1) | |
1st Author's Name | Kohei Nishida |
1st Author's Affiliation | Osaka University(Osaka Univ.) |
2nd Author's Name | Yuhei Terashi |
2nd Author's Affiliation | Osaka University(Osaka Univ.) |
3rd Author's Name | Daisuke Hisano |
3rd Author's Affiliation | Osaka University(Osaka Univ.) |
4th Author's Name | Ken Mishina |
4th Author's Affiliation | Osaka University(Osaka Univ.) |
5th Author's Name | Akihiro Maruta |
5th Author's Affiliation | Osaka University(Osaka Univ.) |
Date | 2023-07-27 |
Paper # | CS2023-18 |
Volume (vol) | vol.123 |
Number (no) | CS-137 |
Page | pp.pp.1-2(CS), |
#Pages | 2 |
Date of Issue | 2023-07-20 (CS) |