| Presentation | 2023-04-22 [Invited Talk] Low Coefficient of thermal expansion PI film and it's Application to Flexible Device Tetsuo Okuyama, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | SDM2023-14,OME2023-14 |
| Date of Issue | 2023-04-14 (SDM, OME) |
| Conference Information | |
| Committee | SDM / OME |
|---|---|
| Conference Date | 2023/4/21(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Okinawaken Seinen Kaikan |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Thin film devices (Si, compound, organic, flexible), Biotechnology, Materials, Characterization, etc. |
| Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) / Toshiki Yamada(NICT) |
| Vice Chair | Tatsuya Usami(ASM Japan) / Eiji Itoh(Shinshu Univ.) |
| Secretary | Tatsuya Usami(Tohoku Univ.) / Eiji Itoh(Panasonic) |
| Assistant | Takuji Hosoi(Kwansei Gakuin Univ.) / Takuya Futase(SanDisk) / Yoshiyuki Seike(Aichi Inst. of Tech.) / Akira Baba(Niigata Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials / Technical Committee on Organic Molecular Electronics |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Low Coefficient of thermal expansion PI film and it's Application to Flexible Device |
| Sub Title (in English) | * |
| Keyword(1) | |
| 1st Author's Name | Tetsuo Okuyama |
| 1st Author's Affiliation | Toyobo Co., Ltd.(Toyobo) |
| Date | 2023-04-22 |
| Paper # | SDM2023-14,OME2023-14 |
| Volume (vol) | vol.123 |
| Number (no) | SDM-8,OME-9 |
| Page | pp.pp.52-54(SDM), pp.52-54(OME), |
| #Pages | 3 |
| Date of Issue | 2023-04-14 (SDM, OME) |