Presentation 2023-04-22
Development of wafer temperature measurement system for non-contact temperature measurement during plasma process
Ryunosuke Goto, Kenshiro Horiuchi, Jiawen Yu, Hiroaki Hanafusa, Seiichiro Higashi,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English)
Paper # SDM2023-17,OME2023-17
Date of Issue 2023-04-14 (SDM, OME)

Conference Information
Committee SDM / OME
Conference Date 2023/4/21(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Okinawaken Seinen Kaikan
Topics (in Japanese) (See Japanese page)
Topics (in English) Thin film devices (Si, compound, organic, flexible), Biotechnology, Materials, Characterization, etc.
Chair Shunichiro Ohmi(Tokyo Inst. of Tech.) / Toshiki Yamada(NICT)
Vice Chair Tatsuya Usami(ASM Japan) / Eiji Itoh(Shinshu Univ.)
Secretary Tatsuya Usami(Tohoku Univ.) / Eiji Itoh(Panasonic)
Assistant Takuji Hosoi(Kwansei Gakuin Univ.) / Takuya Futase(SanDisk) / Yoshiyuki Seike(Aichi Inst. of Tech.) / Akira Baba(Niigata Univ.)

Paper Information
Registration To Technical Committee on Silicon Device and Materials / Technical Committee on Organic Molecular Electronics
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of wafer temperature measurement system for non-contact temperature measurement during plasma process
Sub Title (in English)
Keyword(1)
1st Author's Name Ryunosuke Goto
1st Author's Affiliation Hiroshima University(Hiroshima Univ.)
2nd Author's Name Kenshiro Horiuchi
2nd Author's Affiliation Hiroshima University(Hiroshima Univ.)
3rd Author's Name Jiawen Yu
3rd Author's Affiliation Hiroshima University(Hiroshima Univ.)
4th Author's Name Hiroaki Hanafusa
4th Author's Affiliation Hiroshima University(Hiroshima Univ.)
5th Author's Name Seiichiro Higashi
5th Author's Affiliation Hiroshima University(Hiroshima Univ.)
Date 2023-04-22
Paper # SDM2023-17,OME2023-17
Volume (vol) vol.123
Number (no) SDM-8,OME-9
Page pp.pp.63-66(SDM), pp.63-66(OME),
#Pages 4
Date of Issue 2023-04-14 (SDM, OME)