Presentation 2022-12-19
[Invited Talk] InP-HEMT Fabrication Process Technology for Beyond 5G Wireless Network with THz wave band
Takuya Tsutsumi, Hiroshi Hamada, Teruo Jyo, Hiroki Sugiyama, Taro Sasaki, Hiroyuki Takahashi, Fumito Nakajima,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Next-generation "Beyond 5G (B5G) / 6G" wireless network systems have been researched and developed for meeting with rapid growth of mobile traffics. We report high-yield fabrication process of InP-based high mobility transistors (InP-HEMTs) and Tera-Hertz monolithic ICs (THz-ICs) with 300-GHz-operation which is one of the candidate frequency for B5G/6G network systems. We also introduce InP-based THz-ICs such as 300-GHz power amplifiers and mixers and indicate that InP-based devices are an applicable candidate for B5G/6G.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Beyond 5G (B5G) / 6G / Tera-Hertz ICs (THz-ICs) / Indium phosphide (InP) / High electron mobility transistors (HEMTs) / Backside process / 300-GHz band
Paper # ED2022-76,MWPTHz2022-47
Date of Issue 2022-12-12 (ED, MWPTHz)

Conference Information
Committee ED / MWPTHz
Conference Date 2022/12/19(2days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Hiroki Fujishiro(Tokyo Univ. of Science) / Atsushi Kanno(NICT)
Vice Chair Seiya Sakai(Hokkaido Univ.) / Masayuki Fujita(Osaka Univ.) / Kensuke Ikeda(CRIEPI)
Secretary Seiya Sakai(Saga Univ.) / Masayuki Fujita(NTT) / Kensuke Ikeda(NICT)
Assistant Masatoshi Koyama(Osaka Inst. of Tech.) / Yoshitugu Yamamoto(Mitsubishi Electric) / Li Yi(Osaka Univ.) / Akira Satou(Tohoku Univ.) / Safumi Suzuki(Tokyo Inst. of Tech.)

Paper Information
Registration To Technical Committee on Electron Devices / Technical Committee on Microwave Photonics and Terahertz Photonic-Electronic Technologies
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] InP-HEMT Fabrication Process Technology for Beyond 5G Wireless Network with THz wave band
Sub Title (in English)
Keyword(1) Beyond 5G (B5G) / 6G
Keyword(2) Tera-Hertz ICs (THz-ICs)
Keyword(3) Indium phosphide (InP)
Keyword(4) High electron mobility transistors (HEMTs)
Keyword(5) Backside process
Keyword(6) 300-GHz band
1st Author's Name Takuya Tsutsumi
1st Author's Affiliation Nippon Telegraph and Telephone Corporation(NTT)
2nd Author's Name Hiroshi Hamada
2nd Author's Affiliation Nippon Telegraph and Telephone Corporation(NTT)
3rd Author's Name Teruo Jyo
3rd Author's Affiliation Nippon Telegraph and Telephone Corporation(NTT)
4th Author's Name Hiroki Sugiyama
4th Author's Affiliation Nippon Telegraph and Telephone Corporation(NTT)
5th Author's Name Taro Sasaki
5th Author's Affiliation Nippon Telegraph and Telephone Corporation(NTT)
6th Author's Name Hiroyuki Takahashi
6th Author's Affiliation Nippon Telegraph and Telephone Corporation(NTT)
7th Author's Name Fumito Nakajima
7th Author's Affiliation Nippon Telegraph and Telephone Corporation(NTT)
Date 2022-12-19
Paper # ED2022-76,MWPTHz2022-47
Volume (vol) vol.122
Number (no) ED-319,MWPTHz-320
Page pp.pp.23-27(ED), pp.23-27(MWPTHz),
#Pages 5
Date of Issue 2022-12-12 (ED, MWPTHz)