Presentation | 2022-12-19 [Invited Talk] InP-HEMT Fabrication Process Technology for Beyond 5G Wireless Network with THz wave band Takuya Tsutsumi, Hiroshi Hamada, Teruo Jyo, Hiroki Sugiyama, Taro Sasaki, Hiroyuki Takahashi, Fumito Nakajima, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Next-generation "Beyond 5G (B5G) / 6G" wireless network systems have been researched and developed for meeting with rapid growth of mobile traffics. We report high-yield fabrication process of InP-based high mobility transistors (InP-HEMTs) and Tera-Hertz monolithic ICs (THz-ICs) with 300-GHz-operation which is one of the candidate frequency for B5G/6G network systems. We also introduce InP-based THz-ICs such as 300-GHz power amplifiers and mixers and indicate that InP-based devices are an applicable candidate for B5G/6G. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Beyond 5G (B5G) / 6G / Tera-Hertz ICs (THz-ICs) / Indium phosphide (InP) / High electron mobility transistors (HEMTs) / Backside process / 300-GHz band |
Paper # | ED2022-76,MWPTHz2022-47 |
Date of Issue | 2022-12-12 (ED, MWPTHz) |
Conference Information | |
Committee | ED / MWPTHz |
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Conference Date | 2022/12/19(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | Hiroki Fujishiro(Tokyo Univ. of Science) / Atsushi Kanno(NICT) |
Vice Chair | Seiya Sakai(Hokkaido Univ.) / Masayuki Fujita(Osaka Univ.) / Kensuke Ikeda(CRIEPI) |
Secretary | Seiya Sakai(Saga Univ.) / Masayuki Fujita(NTT) / Kensuke Ikeda(NICT) |
Assistant | Masatoshi Koyama(Osaka Inst. of Tech.) / Yoshitugu Yamamoto(Mitsubishi Electric) / Li Yi(Osaka Univ.) / Akira Satou(Tohoku Univ.) / Safumi Suzuki(Tokyo Inst. of Tech.) |
Paper Information | |
Registration To | Technical Committee on Electron Devices / Technical Committee on Microwave Photonics and Terahertz Photonic-Electronic Technologies |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | [Invited Talk] InP-HEMT Fabrication Process Technology for Beyond 5G Wireless Network with THz wave band |
Sub Title (in English) | |
Keyword(1) | Beyond 5G (B5G) / 6G |
Keyword(2) | Tera-Hertz ICs (THz-ICs) |
Keyword(3) | Indium phosphide (InP) |
Keyword(4) | High electron mobility transistors (HEMTs) |
Keyword(5) | Backside process |
Keyword(6) | 300-GHz band |
1st Author's Name | Takuya Tsutsumi |
1st Author's Affiliation | Nippon Telegraph and Telephone Corporation(NTT) |
2nd Author's Name | Hiroshi Hamada |
2nd Author's Affiliation | Nippon Telegraph and Telephone Corporation(NTT) |
3rd Author's Name | Teruo Jyo |
3rd Author's Affiliation | Nippon Telegraph and Telephone Corporation(NTT) |
4th Author's Name | Hiroki Sugiyama |
4th Author's Affiliation | Nippon Telegraph and Telephone Corporation(NTT) |
5th Author's Name | Taro Sasaki |
5th Author's Affiliation | Nippon Telegraph and Telephone Corporation(NTT) |
6th Author's Name | Hiroyuki Takahashi |
6th Author's Affiliation | Nippon Telegraph and Telephone Corporation(NTT) |
7th Author's Name | Fumito Nakajima |
7th Author's Affiliation | Nippon Telegraph and Telephone Corporation(NTT) |
Date | 2022-12-19 |
Paper # | ED2022-76,MWPTHz2022-47 |
Volume (vol) | vol.122 |
Number (no) | ED-319,MWPTHz-320 |
Page | pp.pp.23-27(ED), pp.23-27(MWPTHz), |
#Pages | 5 |
Date of Issue | 2022-12-12 (ED, MWPTHz) |