Presentation | 2022-11-11 [Invited Talk] SISPAD2022 Review Satofumi Souma, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | The 27th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022) was held on September 5 -- 7 in Granada (Spain). In this report, will review several papers presented at the conference in detail as well as discuss the overall trends of the technological topics included in this year's program. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | SISPAD2022 / review |
Paper # | SDM2022-77 |
Date of Issue | 2022-11-03 (SDM) |
Conference Information | |
Committee | SDM |
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Conference Date | 2022/11/10(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Online |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Process, Device, Circuit simulation, etc. |
Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
Vice Chair | Tatsuya Usami(ASM Japan) |
Secretary | Tatsuya Usami(Tohoku Univ.) |
Assistant | Takuji Hosoi(Kwansei Gakuin Univ.) / Takuya Futase(SanDisk) |
Paper Information | |
Registration To | Technical Committee on Silicon Device and Materials |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | [Invited Talk] SISPAD2022 Review |
Sub Title (in English) | |
Keyword(1) | SISPAD2022 |
Keyword(2) | review |
1st Author's Name | Satofumi Souma |
1st Author's Affiliation | Kobe University(Kobe Univ.) |
Date | 2022-11-11 |
Paper # | SDM2022-77 |
Volume (vol) | vol.122 |
Number (no) | SDM-247 |
Page | pp.pp.61-67(SDM), |
#Pages | 7 |
Date of Issue | 2022-11-03 (SDM) |