| Presentation | 2022-11-29 Evaluating system level security of cryptography module Takumi Matsumaru, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Packaging technology is a technique used to encapsulate semiconductor chips in a frame, and has been attracting attention in recent years as a technology to improve the performance of integrated circuits. We focus on two types of packaging techniques that are expected to become the next generation packaging technologies: 2.5D packaging and 3D packaging. In this study, a semiconductor chip with a type of elliptic curve cryptography was implemented using 2.5D and 3D packaging techniques. Electromagnetic noise measurements were performed on an experimental board in operation to evaluate the acquired waveforms and their variance. Side-channel leakage was also evaluated as part of the electromagnetic noise evaluation. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Packaging Technology / 2.5D Packaging / 3D Packaging / elliptic curve cryptography / Side-Channel attacks |
| Paper # | VLD2022-32,ICD2022-49,DC2022-48,RECONF2022-55 |
| Date of Issue | 2022-11-21 (VLD, ICD, DC, RECONF) |
| Conference Information | |
| Committee | VLD / DC / RECONF / ICD / IPSJ-SLDM |
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| Conference Date | 2022/11/28(3days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kanazawa Bunka Hall |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Design Gaia 2022 -New Field of VLSI Design- |
| Chair | Minako Ikeda(NTT) / Tatsuhiro Tsuchiya(Osaka Univ.) / Kentaro Sano(RIKEN) / Masafumi Takahashi(Kioxia) / Hiroyuki Ochi(Ritsumeikan Univ.) |
| Vice Chair | Shigetoshi Nakatake(Univ. of Kitakyushu) / Toshinori Hosokawa(Nihon Univ.) / Yoshiki Yamaguchi(Tsukuba Univ.) / Tomonori Izumi(Ritsumeikan Univ.) / Makoto Ikeda(Univ. of Tokyo) |
| Secretary | Shigetoshi Nakatake(NBS) / Toshinori Hosokawa(Hirosaki Univ.) / Yoshiki Yamaguchi(Nihon Univ.) / Tomonori Izumi(Chiba Univ.) / Makoto Ikeda(NEC) / (Toyohashi Univ. of Tech.) |
| Assistant | Takuma Nishimoto(Hitachi) / / Yukitaka Takemura(INTEL) / Yasunori Osana(Ryukyu Univ.) / Yoshiaki Yoshihara(KIOXIA) / Jun Shiomi(Osaka Univ.) / Takeshi Kuboki(Sony Semiconductor Solutions) |
| Paper Information | |
| Registration To | Technical Committee on VLSI Design Technologies / Technical Committee on Dependable Computing / Technical Committee on Reconfigurable Systems / Technical Committee on Integrated Circuits and Devices / Special Interest Group on System and LSI Design Methodology |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Evaluating system level security of cryptography module |
| Sub Title (in English) | |
| Keyword(1) | Packaging Technology |
| Keyword(2) | 2.5D Packaging |
| Keyword(3) | 3D Packaging |
| Keyword(4) | elliptic curve cryptography |
| Keyword(5) | Side-Channel attacks |
| 1st Author's Name | Takumi Matsumaru |
| 1st Author's Affiliation | Kobe University(Kobe Univ.) |
| 2nd Author's Name | Kazuki Monta |
| 2nd Author's Affiliation | Kobe University(Kobe Univ.) |
| 3rd Author's Name | Takaaki Okidono |
| 3rd Author's Affiliation | SCU Co., Ltd.(SCU) |
| 4th Author's Name | Takuji Miki |
| 4th Author's Affiliation | Kobe University(Kobe Univ.) |
| 5th Author's Name | Makoto Nagata |
| 5th Author's Affiliation | Kobe University(Kobe Univ.) |
| Date | 2022-11-29 |
| Paper # | VLD2022-32,ICD2022-49,DC2022-48,RECONF2022-55 |
| Volume (vol) | vol.122 |
| Number (no) | VLD-283,ICD-284,DC-285,RECONF-286 |
| Page | pp.pp.78-81(VLD), pp.78-81(ICD), pp.78-81(DC), pp.78-81(RECONF), |
| #Pages | 4 |
| Date of Issue | 2022-11-21 (VLD, ICD, DC, RECONF) |