Presentation | 2022-11-11 Measurement and Modeling of Cycle-to-Cycle Variability in ReRAM Devices Shoma Yoshimoto, Masaki Takemori, Yoshinari Kamakura, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Cycle-to-cycle (C2C) variability in ReRAM devices is investigated experimentally. The measured data are fitted to the SPICE simulations, and the C2C variability of the model parameters are evaluated. No strong correlations are found in the parameter values for the adjacent cycles, while in long-term cycles some parameters change gradually. The origin of the observed characteristics is discussed based on the internal states of ReRAM devices. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | ReRAM / SPICE Model / Cycle-to-Cycle Variation / Parameter Fitting |
Paper # | SDM2022-78 |
Date of Issue | 2022-11-03 (SDM) |
Conference Information | |
Committee | SDM |
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Conference Date | 2022/11/10(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Online |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Process, Device, Circuit simulation, etc. |
Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
Vice Chair | Tatsuya Usami(ASM Japan) |
Secretary | Tatsuya Usami(Tohoku Univ.) |
Assistant | Takuji Hosoi(Kwansei Gakuin Univ.) / Takuya Futase(SanDisk) |
Paper Information | |
Registration To | Technical Committee on Silicon Device and Materials |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Measurement and Modeling of Cycle-to-Cycle Variability in ReRAM Devices |
Sub Title (in English) | |
Keyword(1) | ReRAM |
Keyword(2) | SPICE Model |
Keyword(3) | Cycle-to-Cycle Variation |
Keyword(4) | Parameter Fitting |
1st Author's Name | Shoma Yoshimoto |
1st Author's Affiliation | Osaka Institute of Technology(OIT) |
2nd Author's Name | Masaki Takemori |
2nd Author's Affiliation | Osaka Institute of Technology(OIT) |
3rd Author's Name | Yoshinari Kamakura |
3rd Author's Affiliation | Osaka Institute of Technology(OIT) |
Date | 2022-11-11 |
Paper # | SDM2022-78 |
Volume (vol) | vol.122 |
Number (no) | SDM-247 |
Page | pp.pp.68-72(SDM), |
#Pages | 5 |
Date of Issue | 2022-11-03 (SDM) |