Presentation 2022-11-11
Measurement and Modeling of Cycle-to-Cycle Variability in ReRAM Devices
Shoma Yoshimoto, Masaki Takemori, Yoshinari Kamakura,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Cycle-to-cycle (C2C) variability in ReRAM devices is investigated experimentally. The measured data are fitted to the SPICE simulations, and the C2C variability of the model parameters are evaluated. No strong correlations are found in the parameter values for the adjacent cycles, while in long-term cycles some parameters change gradually. The origin of the observed characteristics is discussed based on the internal states of ReRAM devices.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) ReRAM / SPICE Model / Cycle-to-Cycle Variation / Parameter Fitting
Paper # SDM2022-78
Date of Issue 2022-11-03 (SDM)

Conference Information
Committee SDM
Conference Date 2022/11/10(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English) Process, Device, Circuit simulation, etc.
Chair Shunichiro Ohmi(Tokyo Inst. of Tech.)
Vice Chair Tatsuya Usami(ASM Japan)
Secretary Tatsuya Usami(Tohoku Univ.)
Assistant Takuji Hosoi(Kwansei Gakuin Univ.) / Takuya Futase(SanDisk)

Paper Information
Registration To Technical Committee on Silicon Device and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Measurement and Modeling of Cycle-to-Cycle Variability in ReRAM Devices
Sub Title (in English)
Keyword(1) ReRAM
Keyword(2) SPICE Model
Keyword(3) Cycle-to-Cycle Variation
Keyword(4) Parameter Fitting
1st Author's Name Shoma Yoshimoto
1st Author's Affiliation Osaka Institute of Technology(OIT)
2nd Author's Name Masaki Takemori
2nd Author's Affiliation Osaka Institute of Technology(OIT)
3rd Author's Name Yoshinari Kamakura
3rd Author's Affiliation Osaka Institute of Technology(OIT)
Date 2022-11-11
Paper # SDM2022-78
Volume (vol) vol.122
Number (no) SDM-247
Page pp.pp.68-72(SDM),
#Pages 5
Date of Issue 2022-11-03 (SDM)