Presentation 2022-08-09
Development of high quality factor HTS bulk coil and its application to Wireless Power Transfer system
Natsuka Oshimoto, Keita Sakuma, Naoto Sekiya,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) In this study, we proposed the method that decrease the resonant frequency (f0) of high temperature superconductor (HTS) bulk coil by the thickness of sapphire substrates which supported HTS bulk coil because there is limit to diameter of HTS bulk. We fabricated HTS bulk coil (coil diameter of 65 mm) which optimized line width and line gap of coil. The measured quality factor of it was 9,431, this was 12 times higher than that of copper coil. Moreover, at distance between coils of 20 cm, a power transfer efficiency of wireless power transfer (WPT) system using HTS bulk coil and copper coil as transmitting and receiving coil were 74.8% and 20.6%, respectively. As a result, we achieved high transfer efficiency WPT system using high quality factor HTS bulk coil.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) wireless power transfer / high temperature superconductor / superconducting bulk / high quality factor coil
Paper # SCE2022-8
Date of Issue 2022-08-02 (SCE)

Conference Information
Committee SCE
Conference Date 2022/8/9(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Yoshio Mizugaki(Univ. of Electro-Comm.)
Vice Chair
Secretary (Fukuoka Inst. of Tech)
Assistant Hiroyuki Akaike(Daido Univ.)

Paper Information
Registration To Technical Committee on Superconductive Electronics
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of high quality factor HTS bulk coil and its application to Wireless Power Transfer system
Sub Title (in English)
Keyword(1) wireless power transfer
Keyword(2) high temperature superconductor
Keyword(3) superconducting bulk
Keyword(4) high quality factor coil
1st Author's Name Natsuka Oshimoto
1st Author's Affiliation Yamanashi University(Yamanashi Univ.)
2nd Author's Name Keita Sakuma
2nd Author's Affiliation Yamanashi University(Yamanashi Univ.)
3rd Author's Name Naoto Sekiya
3rd Author's Affiliation Yamanashi University(Yamanashi Univ.)
Date 2022-08-09
Paper # SCE2022-8
Volume (vol) vol.122
Number (no) SCE-150
Page pp.pp.39-42(SCE),
#Pages 4
Date of Issue 2022-08-02 (SCE)