| Presentation | 2022-06-16 Dynamic Temperature Control Algorithm for 3-D Stacked Chips based on Thermal Analysis Songxiang Wang, Kimiyoshi Usami, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The problem of heat generation is more serious in 3D stacked chips than in non-stacked counterparts. In this study, we focus on 3D-LSIs which use a wireless communication technique called TCI (ThruChip Interface) and propose a thermal management method that reflects the characteristics of the structure. In particular, we focus on the factor of “ease of temperature rise” that varies depending on the position inside the 3D stacked chips, and developed a dynamic temperature control algorithm that incorporates this factor through temperature analysis by moving tasks. Simulation results demonstrated effectiveness of the proposed method. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | 3D-LSI / Dynamic Temperature Control / Task Migration / Thermal Management |
| Paper # | CAS2022-10,VLD2022-10,SIP2022-41,MSS2022-10 |
| Date of Issue | 2022-06-09 (CAS, VLD, SIP, MSS) |
| Conference Information | |
| Committee | CAS / SIP / VLD / MSS |
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| Conference Date | 2022/6/16(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Hachinohe Institute of Technology |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Yoshinobu Maeda(Niigata Univ.) / Yukihiro Bandou(NTT) / Kazutoshi Kobayashi(Kyoto Inst. of Tech.) / Atsuo Ozaki(Osaka Inst. of Tech.) |
| Vice Chair | Yasutoshi Aibara(OmniVisionManufacturing) / Toshihisa Tanaka(Tokyo Univ. Agri.&Tech.) / Takayuki Nakachi(Ryukyu Univ.) / Minako Ikeda(NTT) / Shingo Yamaguchi(Yamaguchi Univ.) |
| Secretary | Yasutoshi Aibara(NIT, Toyama college) / Toshihisa Tanaka(Renesas) / Takayuki Nakachi(Xiaomi) / Minako Ikeda(Takushoku Univ.) / Shingo Yamaguchi(Tokyo Univ. Agri.&Tech.) |
| Assistant | Motoi Yamaguchi(TECHNOPRO) / Yohei Nakamura(Hitachi) / Takahide Sato(Univ. of Yamanashi) / Shinji Shimoda(Sony LSI Design) / Shunsuke Koshita(Hachinohe Inst. of Tech.) / Taichi Yoshida(UEC) / Seisuke Kyochi(Univ. of Kitakyushu) / / Masato Shirai(Shimane Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Circuits and Systems / Technical Committee on Signal Processing / Technical Committee on VLSI Design Technologies / Technical Committee on Mathematical Systems Science and its Applications |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Dynamic Temperature Control Algorithm for 3-D Stacked Chips based on Thermal Analysis |
| Sub Title (in English) | |
| Keyword(1) | 3D-LSI |
| Keyword(2) | Dynamic Temperature Control |
| Keyword(3) | Task Migration |
| Keyword(4) | Thermal Management |
| 1st Author's Name | Songxiang Wang |
| 1st Author's Affiliation | Shibaura Institute of Technology(Shibaura IT) |
| 2nd Author's Name | Kimiyoshi Usami |
| 2nd Author's Affiliation | Shibaura Institute of Technology(Shibaura IT) |
| Date | 2022-06-16 |
| Paper # | CAS2022-10,VLD2022-10,SIP2022-41,MSS2022-10 |
| Volume (vol) | vol.122 |
| Number (no) | CAS-75,VLD-76,SIP-77,MSS-78 |
| Page | pp.pp.52-57(CAS), pp.52-57(VLD), pp.52-57(SIP), pp.52-57(MSS), |
| #Pages | 6 |
| Date of Issue | 2022-06-09 (CAS, VLD, SIP, MSS) |