Presentation 2022-03-04
Reduction of radiated noise in the printed wiring board power supply layer
Shuitiro Kotaki, Sinichi Sasaki,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) In recent years, with the multi-functionalization of information devices, radiation noise by power supply noise waves in a circuit board generated by the high-speed operation of the mounted LSI is a problem. In this laboratory, a method is proposed to add resistance between the power supply layers at the end of the substrate and reduce noise. So far, it has been confirmed that the same resistance value as the characteristic impedance value of the line having the resistor addition pitch is effective. However, depending on the addition method and structure to the substrate end, the noise wave was not optimal resistance value. In this study, the purpose is to clarify the optimal resistance value due to the difference in addition method and structure. Currently, we are examining the case where the alignment resistance is added to the substrate end of the flat substrate and the circular substrate as a structure. As a result of the characteristic impedance evaluation by three-dimensional electrical field analysis so far, it was confirmed that there is a difference in the optimum value by the structure. In the future, we will investigate the resistance value effective for reducing radiation noise.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Radiation noise / Characteristic impedance
Paper # EMCJ2021-73
Date of Issue 2022-02-25 (EMCJ)

Conference Information
Committee MICT / EMCJ
Conference Date 2022/3/4(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English) Healthcare and Medical Information Communication Technologies, EMC, etc
Chair Eisuke Hanada(Saga Univ.) / Atsuhiro Nishikata(Tokyo Inst. of Tech.)
Vice Chair Hirokazu Tanaka(Hiroshima City Univ.) / Daisuke Anzai(Nagoya Inst. of Tech.) / Kimihiro Tajima(NTT-AT)
Secretary Hirokazu Tanaka(Yokohama National Univ.) / Daisuke Anzai(KISTEC) / Kimihiro Tajima(NAIST)
Assistant Takahiro Ito(Hiroshima City Univ) / Kento Takabayashi(Okayama Pref. Univ.) / Takuya Nishikawa(National Cerebral and Cardiovascular Center Hospital) / Kiyoto Matsushima(Hitachi) / Hiroyoshi Shida(EMC Tech.) / Toru Matsushima(Kyushu Inst. of Tech.)

Paper Information
Registration To Technical Committee on Healthcare and Medical Information Communication Technology / Technical Committee on Electromagnetic Compatibility
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Reduction of radiated noise in the printed wiring board power supply layer
Sub Title (in English) Effect of resistance structure
Keyword(1) Radiation noise
Keyword(2) Characteristic impedance
1st Author's Name Shuitiro Kotaki
1st Author's Affiliation Saga University Graduate School(Saga Univ)
2nd Author's Name Sinichi Sasaki
2nd Author's Affiliation Saga University(Saga Univ)
Date 2022-03-04
Paper # EMCJ2021-73
Volume (vol) vol.121
Number (no) EMCJ-403
Page pp.pp.7-10(EMCJ),
#Pages 4
Date of Issue 2022-02-25 (EMCJ)