Presentation 2022-02-04
[Invited Talk] Advanced Damascene Integration with Self Assembled Monolayer (SAM)
Hiroyuki Nagai, Mitsuaki Iwashita, Yuki Kikuchi, Kawasaki Hiroaki, Gyana Pattanaik, Keiichi Fujita, Kazutoshi Iwai, Hiroyuki Komatsu, Yuuki Ozaki,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English)
Paper # SDM2021-75
Date of Issue 2022-01-28 (SDM)

Conference Information
Committee SDM
Conference Date 2022/2/4(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Hiroshige Hirano(TowerPartners Semiconductor)
Vice Chair Shunichiro Ohmi(Tokyo Inst. of Tech.)
Secretary Shunichiro Ohmi(AIST)
Assistant Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.)

Paper Information
Registration To Technical Committee on Silicon Device and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] Advanced Damascene Integration with Self Assembled Monolayer (SAM)
Sub Title (in English)
Keyword(1)
1st Author's Name Hiroyuki Nagai
1st Author's Affiliation Tokyo Electron Limited(TEL)
2nd Author's Name Mitsuaki Iwashita
2nd Author's Affiliation Tokyo Electron Limited(TEL)
3rd Author's Name Yuki Kikuchi
3rd Author's Affiliation Tokyo Electron Limited(TEL)
4th Author's Name Kawasaki Hiroaki
4th Author's Affiliation TEL Technology Center, America, LLC(TTCA)
5th Author's Name Gyana Pattanaik
5th Author's Affiliation TEL Technology Center, America, LLC(TTCA)
6th Author's Name Keiichi Fujita
6th Author's Affiliation Tokyo Electron Kyushu Limited(TKL)
7th Author's Name Kazutoshi Iwai
7th Author's Affiliation Tokyo Electron America, Inc.(TEA)
8th Author's Name Hiroyuki Komatsu
8th Author's Affiliation JSR corporation(JSR)
9th Author's Name Yuuki Ozaki
9th Author's Affiliation JSR corporation(JSR)
Date 2022-02-04
Paper # SDM2021-75
Volume (vol) vol.121
Number (no) SDM-366
Page pp.pp.5-8(SDM),
#Pages 4
Date of Issue 2022-01-28 (SDM)