Presentation 2022-01-31
[Invited Talk] ****
Keiichi Nakazawa, Junpei Yamamoto, Shigetaka Mori, Shintaro Okamoto, Akito Shimizu, Koichi Baba, Nobutoshi Fujii, Mutsuo Uehara, Katsunori Hiramatsu, Hideomi Kumano, Akira Matsumoto, Koichiro Zaitsu, Hidetoshi Ohnuma, Keiji Tatani, Tomoyuki Hirano, Hayato Iwamoto,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We developed a new structure of pixel transistors stacked over photodiode named “2-Layer Transistor Pixel Stacked CMOS Image Sensor” (2-Layer Pixel). It was fabricated by 3D sequential process integration with new process techniques, such as thermally stable wafer bonding and deep contacts. With this technology, we successfully increased AMP size and demonstrated backside-illuminated CMOS image sensor of 6752 x 4928 pixels at 0.7um pitch to prove its functionality and integrity.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) 3D Sequential / 2-Layer Pixel / wafer bonding / deep contact
Paper # SDM2021-73
Date of Issue 2022-01-24 (SDM)

Conference Information
Committee SDM
Conference Date 2022/1/31(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Hiroshige Hirano(TowerPartners Semiconductor)
Vice Chair Shunichiro Ohmi(Tokyo Inst. of Tech.)
Secretary Shunichiro Ohmi(AIST)
Assistant Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.)

Paper Information
Registration To Technical Committee on Silicon Device and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] ****
Sub Title (in English)
Keyword(1) 3D Sequential
Keyword(2) 2-Layer Pixel
Keyword(3) wafer bonding
Keyword(4) deep contact
1st Author's Name Keiichi Nakazawa
1st Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
2nd Author's Name Junpei Yamamoto
2nd Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
3rd Author's Name Shigetaka Mori
3rd Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
4th Author's Name Shintaro Okamoto
4th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
5th Author's Name Akito Shimizu
5th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
6th Author's Name Koichi Baba
6th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
7th Author's Name Nobutoshi Fujii
7th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
8th Author's Name Mutsuo Uehara
8th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
9th Author's Name Katsunori Hiramatsu
9th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
10th Author's Name Hideomi Kumano
10th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
11th Author's Name Akira Matsumoto
11th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
12th Author's Name Koichiro Zaitsu
12th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
13th Author's Name Hidetoshi Ohnuma
13th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
14th Author's Name Keiji Tatani
14th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
15th Author's Name Tomoyuki Hirano
15th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
16th Author's Name Hayato Iwamoto
16th Author's Affiliation Sony Semiconductor Solutions(Sony Semiconductor Solutions)
Date 2022-01-31
Paper # SDM2021-73
Volume (vol) vol.121
Number (no) SDM-365
Page pp.pp.20-23(SDM),
#Pages 4
Date of Issue 2022-01-24 (SDM)