Presentation | 2021-12-16 Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors Taisei Urakami, Tamami Maruyama, Akira Ono, Takahiro Shiozawa, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | The novel patch element shapes with the interdigital and multi-via structures of a mushroom-type metasurface reflector have been proposed for controlling the reflection phases. The reflector with the constant reflection direction, placed in the near field of a transmitting antenna, is designed using these structures. In this case, the design method considering the incident wave phase distribution are required, since the incident wave phases vary according to the position on the metasurface. The parameters of each patch element with the interdigital and multi-via structures are designed to realize the desired reflection phases on the metasurface, determined by combining the simulated incident wave phase distribution and the ray tracing method. The measured directivity of the prototype metasurface in our anechoic chamber shows the good agreement between the measured and designed reflection direction. The effectiveness of the proposed structure and design method is confirmed from this measurement result. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Reflector / Metasurface / Metamaterial / Finite element method / Ray tracing method |
Paper # | MW2021-84 |
Date of Issue | 2021-12-09 (MW) |
Conference Information | |
Committee | MW |
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Conference Date | 2021/12/16(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Kawasaki City Industrial Promotion Hall |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Microwave/Presentation and Award Ceremony of SDC |
Chair | Noriharu Suematsu(Tohoku Univ.) |
Vice Chair | Tadashi Kawai(Univ. of Hyogo) / Kensuke Okubo(Okayama Prefectural Univ.) / Hideyuki Nakamizo(Mitsubishi Electric) |
Secretary | Tadashi Kawai(Saitama Univ.) / Kensuke Okubo(Toshiba) / Hideyuki Nakamizo |
Assistant | Naoki Hasegawa(Softbank) / Kosuke Katayama(NIT, Tokuyama College) |
Paper Information | |
Registration To | Technical Committee on Microwaves |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors |
Sub Title (in English) | Simulation-Based Design and Evaluation Experiments |
Keyword(1) | Reflector |
Keyword(2) | Metasurface |
Keyword(3) | Metamaterial |
Keyword(4) | Finite element method |
Keyword(5) | Ray tracing method |
1st Author's Name | Taisei Urakami |
1st Author's Affiliation | National Institute of Technology (KOSEN), Kagawa College(NIT (KOSEN), Kagawa College) |
2nd Author's Name | Tamami Maruyama |
2nd Author's Affiliation | National Institute of Technology (KOSEN), Hakodate College(NIT (KOSEN), Hakodate College) |
3rd Author's Name | Akira Ono |
3rd Author's Affiliation | National Institute of Technology (KOSEN), Kagawa College(NIT (KOSEN), Kagawa College) |
4th Author's Name | Takahiro Shiozawa |
4th Author's Affiliation | National Institute of Technology (KOSEN), Kagawa College(NIT (KOSEN), Kagawa College) |
Date | 2021-12-16 |
Paper # | MW2021-84 |
Volume (vol) | vol.121 |
Number (no) | MW-303 |
Page | pp.pp.1-6(MW), |
#Pages | 6 |
Date of Issue | 2021-12-09 (MW) |