Presentation 2021-12-16
Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors
Taisei Urakami, Tamami Maruyama, Akira Ono, Takahiro Shiozawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The novel patch element shapes with the interdigital and multi-via structures of a mushroom-type metasurface reflector have been proposed for controlling the reflection phases. The reflector with the constant reflection direction, placed in the near field of a transmitting antenna, is designed using these structures. In this case, the design method considering the incident wave phase distribution are required, since the incident wave phases vary according to the position on the metasurface. The parameters of each patch element with the interdigital and multi-via structures are designed to realize the desired reflection phases on the metasurface, determined by combining the simulated incident wave phase distribution and the ray tracing method. The measured directivity of the prototype metasurface in our anechoic chamber shows the good agreement between the measured and designed reflection direction. The effectiveness of the proposed structure and design method is confirmed from this measurement result.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Reflector / Metasurface / Metamaterial / Finite element method / Ray tracing method
Paper # MW2021-84
Date of Issue 2021-12-09 (MW)

Conference Information
Committee MW
Conference Date 2021/12/16(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Kawasaki City Industrial Promotion Hall
Topics (in Japanese) (See Japanese page)
Topics (in English) Microwave/Presentation and Award Ceremony of SDC
Chair Noriharu Suematsu(Tohoku Univ.)
Vice Chair Tadashi Kawai(Univ. of Hyogo) / Kensuke Okubo(Okayama Prefectural Univ.) / Hideyuki Nakamizo(Mitsubishi Electric)
Secretary Tadashi Kawai(Saitama Univ.) / Kensuke Okubo(Toshiba) / Hideyuki Nakamizo
Assistant Naoki Hasegawa(Softbank) / Kosuke Katayama(NIT, Tokuyama College)

Paper Information
Registration To Technical Committee on Microwaves
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors
Sub Title (in English) Simulation-Based Design and Evaluation Experiments
Keyword(1) Reflector
Keyword(2) Metasurface
Keyword(3) Metamaterial
Keyword(4) Finite element method
Keyword(5) Ray tracing method
1st Author's Name Taisei Urakami
1st Author's Affiliation National Institute of Technology (KOSEN), Kagawa College(NIT (KOSEN), Kagawa College)
2nd Author's Name Tamami Maruyama
2nd Author's Affiliation National Institute of Technology (KOSEN), Hakodate College(NIT (KOSEN), Hakodate College)
3rd Author's Name Akira Ono
3rd Author's Affiliation National Institute of Technology (KOSEN), Kagawa College(NIT (KOSEN), Kagawa College)
4th Author's Name Takahiro Shiozawa
4th Author's Affiliation National Institute of Technology (KOSEN), Kagawa College(NIT (KOSEN), Kagawa College)
Date 2021-12-16
Paper # MW2021-84
Volume (vol) vol.121
Number (no) MW-303
Page pp.pp.1-6(MW),
#Pages 6
Date of Issue 2021-12-09 (MW)