| Presentation | 2021-11-11 [Invited Talk] SISPAD2021 Review Hideki Minari, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) was held on September 27-29, 2021 in a hybrid format (online + on-site (Dallas, USA)). In this report, the trend of statistical data of this conference is reported. I also review the selected papers presented at the conference. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | SISPAD / modeling / simulation |
| Paper # | SDM2021-59 |
| Date of Issue | 2021-11-04 (SDM) |
| Conference Information | |
| Committee | SDM |
|---|---|
| Conference Date | 2021/11/11(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Process, Device, Circuit simulation, etc. |
| Chair | Hiroshige Hirano(TowerPartners Semiconductor) |
| Vice Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
| Secretary | Shunichiro Ohmi(AIST) |
| Assistant | Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] SISPAD2021 Review |
| Sub Title (in English) | |
| Keyword(1) | SISPAD |
| Keyword(2) | modeling |
| Keyword(3) | simulation |
| 1st Author's Name | Hideki Minari |
| 1st Author's Affiliation | Sony Semiconductor Solutions Corporation(Sony Semiconductor Solutions) |
| Date | 2021-11-11 |
| Paper # | SDM2021-59 |
| Volume (vol) | vol.121 |
| Number (no) | SDM-235 |
| Page | pp.pp.33-37(SDM), |
| #Pages | 5 |
| Date of Issue | 2021-11-04 (SDM) |