Presentation 2021-07-15
The proposal of high-density wiring in data center board using double core fibers
Hongli Yu, Souiti Kobayashi, Naoto Yoshimoto,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Due to the rapid increase in the amount of data in recent years, the optical wiring in the board has become one of the challenges for miniaturization of communication equipment. We propose a high-density wiring method using multi-core fiber with double-core structure suitable for connection between the in-board MPO connector and SiPh. This report is the results of simulation about the optical characteristics of the proposed double-core fiber and its effect during bending. In addition, we introduce the results of a study on the possibility of multi-core fibers with double core structure aiming for higher densities.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) High-density optical wiring / double-core fiber / multi-core fiber / photonic integration / data center
Paper # EMT2021-7,MW2021-12,OPE2021-1,EST2021-8,MWP2021-9
Date of Issue 2021-07-08 (EMT, MW, OPE, EST, MWP)

Conference Information
Committee OPE / MW / IEE-EMT / MWP / EST / EMT
Conference Date 2021/7/15(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Takaaki Ishigure(Keio Univ.) / Noriharu Suematsu(Tohoku Univ.) / Akira Matsuhima(Kumamoto University) / Akihiko Hirata(Chiba Inst. of Tech.) / Jun Shibayama(Hosei Univ.) / Hiroyuki Deguchi(Doshisha Univ.)
Vice Chair Toshikazu Hashimoto(NTT) / Tadashi Kawai(Univ. of Hyogo) / Kensuke Okubo(Okayama Prefectural Univ.) / Hideyuki Nakamizo(Mitsubishi Electric) / / Atsushi Kanno(NICT) / Masayuki Kimishima(Advantest) / Yasuhide Tsuji(Muroran Inst. of Tech.) / Yasuo Ohtera(Toyama Prefectural Univ.) / Hideki Kawaguchi(Muroran Inst. of Tech)
Secretary Toshikazu Hashimoto(Tokushima Univ.) / Tadashi Kawai(Kagoshima Univ.) / Kensuke Okubo(Saitama Univ.) / Hideyuki Nakamizo(Toshiba) / (Metropolitan college of industrial technology) / Atsushi Kanno(Muroran IT) / Masayuki Kimishima(Yazaki) / Yasuhide Tsuji(CRIEPI) / Yasuo Ohtera(ENRI) / Hideki Kawaguchi(yoto Univ.)
Assistant Hirokazu Kobayashi(Kochi Univ. of Tech) / Tadashi Murao(Mitsubishi Electric) / Naoki Hasegawa(Softbank) / Kosuke Katayama(Waseda Univ.) / Junichiro Sugisaka(Kitami institute technology) / Li Yi(Osaka Univ.) / Yuya Yamaguchi(NICT) / Seiya Kishimoto(Nihon Univ.) / Akito Iguchi(Muroran Inst. of Tech) / Kazuki Niino(Kyoto Univ.)

Paper Information
Registration To Technical Committee on OptoElectronics / Technical Committee on Microwaves / Technical Meeting on Electromagnetic Theory / Technical Committee on Microwave and Millimeter-wave Photonics / Technical Committee on Electronics Simulation Technology / Technical Committee on Electromagnetic Theory
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) The proposal of high-density wiring in data center board using double core fibers
Sub Title (in English)
Keyword(1) High-density optical wiring
Keyword(2) double-core fiber
Keyword(3) multi-core fiber
Keyword(4) photonic integration
Keyword(5) data center
1st Author's Name Hongli Yu
1st Author's Affiliation Chitose Institute of Science and Technology(CIST)
2nd Author's Name Souiti Kobayashi
2nd Author's Affiliation Photonic Science Technology Inc.(PSTI)
3rd Author's Name Naoto Yoshimoto
3rd Author's Affiliation Chitose Institute of Science and Technology(CIST)
Date 2021-07-15
Paper # EMT2021-7,MW2021-12,OPE2021-1,EST2021-8,MWP2021-9
Volume (vol) vol.121
Number (no) EMT-106,MW-107,OPE-108,EST-109,MWP-110
Page pp.pp.1-4(EMT), pp.1-4(MW), pp.1-4(OPE), pp.1-4(EST), pp.1-4(MWP),
#Pages 4
Date of Issue 2021-07-08 (EMT, MW, OPE, EST, MWP)