Presentation 2021-03-04
Experiments of Data Authenticity Verification in Multi-Node IoT Systems Using Elliptic Curve Digital Signature Chips
Yuya Takahashi, Takuya Matsumaru, Kazuki Monta, Toshihiro Sato, Takaaki Okidono, Takuji Miki, Noriyuki Miura, Makoto Nagata,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Practicality of IoT systems requires the efficiency and speed of crypto processing in edge nodes and remote servers. So far software implementation is often present for wide-area system realization, however, the validity of hardware or hybrid implementation is not much pursued. In our previous works, ECDSA chips for digital signature generation and verification have been developed in a 130 nm CMOS technology. This paper reports the evaluation results of pseudo IoT networks adopting those ECDSA chips in terms of data transfer, signature verification and system-level throughputs.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Elliptic Curve Digital Signature / Digital Signature / Hardware Accelerator / Signature / IoT / ASIC / FPGA
Paper # VLD2020-85,HWS2020-60
Date of Issue 2021-02-24 (VLD, HWS)

Conference Information
Committee HWS / VLD
Conference Date 2021/3/3(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English) Design Technology for System-on-Silicon, Hardware Security, etc.
Chair Makoto Ikeda(Univ. of Tokyo) / Daisuke Fukuda(Fujitsu Labs.)
Vice Chair Yasuhisa Shimazaki(Renesas Electronics) / Makoto Nagata(Kobe Univ.) / Kazutoshi Kobayashi(Kyoto Inst. of Tech.)
Secretary Yasuhisa Shimazaki(Kyushu Univ.) / Makoto Nagata(NTT) / Kazutoshi Kobayashi(Hitachi)
Assistant / Takuma Nishimoto(Hitachi)

Paper Information
Registration To Technical Committee on Hardware Security / Technical Committee on VLSI Design Technologies
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Experiments of Data Authenticity Verification in Multi-Node IoT Systems Using Elliptic Curve Digital Signature Chips
Sub Title (in English)
Keyword(1) Elliptic Curve Digital Signature
Keyword(2) Digital Signature
Keyword(3) Hardware Accelerator
Keyword(4) Signature
Keyword(5) IoT
Keyword(6) ASIC
Keyword(7) FPGA
1st Author's Name Yuya Takahashi
1st Author's Affiliation Kobe University(Kobe Univ.)
2nd Author's Name Takuya Matsumaru
2nd Author's Affiliation Kobe University(Kobe Univ.)
3rd Author's Name Kazuki Monta
3rd Author's Affiliation Kobe University(Kobe Univ.)
4th Author's Name Toshihiro Sato
4th Author's Affiliation ECSEC Laboratory(ECSEC Lab)
5th Author's Name Takaaki Okidono
5th Author's Affiliation ECSEC Laboratory(ECSEC Lab)
6th Author's Name Takuji Miki
6th Author's Affiliation Kobe University(Kobe Univ.)
7th Author's Name Noriyuki Miura
7th Author's Affiliation Kobe University(Kobe Univ.)
8th Author's Name Makoto Nagata
8th Author's Affiliation Kobe University(Kobe Univ.)
Date 2021-03-04
Paper # VLD2020-85,HWS2020-60
Volume (vol) vol.120
Number (no) VLD-400,HWS-401
Page pp.pp.97-101(VLD), pp.97-101(HWS),
#Pages 5
Date of Issue 2021-02-24 (VLD, HWS)