| Presentation | 2021-02-05 [Invited Talk] R&D of 3D-IC Technology in the era of AI, IoT, Big data Katsuya Kikuchi, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | 3D integration is one of the most important technologies for developing new-generation electronics devices. In this article, it is reported R&D of 3D integration technology for contributing to the era of AI, IoT, Big data. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | AI?IoT?Big data / 3D integration technology |
| Paper # | SDM2020-60 |
| Date of Issue | 2021-01-29 (SDM) |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 2021/2/5(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Hiroshige Hirano(TowerPartners Semiconductor) |
| Vice Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
| Secretary | Shunichiro Ohmi(AIST) |
| Assistant | Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] R&D of 3D-IC Technology in the era of AI, IoT, Big data |
| Sub Title (in English) | |
| Keyword(1) | AI?IoT?Big data |
| Keyword(2) | 3D integration technology |
| 1st Author's Name | Katsuya Kikuchi |
| 1st Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| Date | 2021-02-05 |
| Paper # | SDM2020-60 |
| Volume (vol) | vol.120 |
| Number (no) | SDM-359 |
| Page | pp.pp.23-26(SDM), |
| #Pages | 4 |
| Date of Issue | 2021-01-29 (SDM) |