| Presentation | 2021-02-12 [Invited Talk] Reliability physics issues for electronic devices Yasushi Kadota, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Many kind of electronic devices, including semiconductor devices, have been using in various fields and applications in the market. The types of failures of electronic devices that occur in the market today are often caused by unexpected failures in special environments, usage methods, and processes. Therefore, one of the main concerns in reliability development is the identification of complex failure mechanisms caused by special environments and their combinations, and reliability programs that emphasize physical failure analysis, risk assessment, and complex environment testing are in operation. On the other hand, the technical issues of reliability physics related to individual failure mechanisms have not been resolved. For example, dielectric breakdown over time (TDDB) has not been completely clarified in terms of reliability physics, and some aspects are still being considered based on reliability test results and material property measurements. One of the main reasons for this is that it is difficult to detect the location of failures in short-circuit systems due to secondary failures, making it difficult for physical failure analysis to function in the micro region. As described above, technical issues related to the reliability physics of electronic devices still exist in various fields, and various technical activities will be necessary in the future. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Reliability physics / Physical failure analysis / Lifetime prediction equation / Time dependent die electric breakdown / Eyring model / Ceramic polycrystalline film |
| Paper # | R2020-37,EMD2020-28 |
| Date of Issue | 2021-02-05 (R, EMD) |
| Conference Information | |
| Committee | EMD / R |
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| Conference Date | 2021/2/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Yoshiki Kayano(Univ. of Electro-Comm.) / Akira Asato(Fujitsu) |
| Vice Chair | / Tadashi Dohi(Hiroshima Univ.) |
| Secretary | (Nippon Inst. of Tech.) / Tadashi Dohi(Hosei Univ.) |
| Assistant | Yuichi Hayashi(ＮＡＩＳＴ) / Kazuaki Miyanaga(Fujitsu Component) / Hiroyuki Okamura(Hiroshima Univ.) / Shinji Yokogawa(Univ. of Electro-Comm.) |
| Paper Information | |
| Registration To | Technical Committee on Electromechanical Devices / Technical Committee on Reliability |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Reliability physics issues for electronic devices |
| Sub Title (in English) | Failure mechanisms that still need to be physically clarified |
| Keyword(1) | Reliability physics |
| Keyword(2) | Physical failure analysis |
| Keyword(3) | Lifetime prediction equation |
| Keyword(4) | Time dependent die electric breakdown |
| Keyword(5) | Eyring model |
| Keyword(6) | Ceramic polycrystalline film |
| 1st Author's Name | Yasushi Kadota |
| 1st Author's Affiliation | RICOH Company, Limited(RICOH Co.,Ltd.) |
| Date | 2021-02-12 |
| Paper # | R2020-37,EMD2020-28 |
| Volume (vol) | vol.120 |
| Number (no) | R-360,EMD-361 |
| Page | pp.pp.19-24(R), pp.19-24(EMD), |
| #Pages | 6 |
| Date of Issue | 2021-02-05 (R, EMD) |