| Presentation | 2021-02-05 [Invited Talk] AI for material, material for AI Shintaro Yamamichi, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Future of Computing realized by Hybrid Cloud integrating three calculation elements, bits, neurons and qubits, is introduced, and relationship between AI and material development is discussed. A novel AI technology with inverse structure design accelerates the material discovery. A novel bumping technology combined with a nano-paste material is developed for AI dedicated hardware. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | AI / material informatics / packaging / bumping |
| Paper # | SDM2020-59 |
| Date of Issue | 2021-01-29 (SDM) |
| Conference Information | |
| Committee | SDM |
|---|---|
| Conference Date | 2021/2/5(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Hiroshige Hirano(TowerPartners Semiconductor) |
| Vice Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
| Secretary | Shunichiro Ohmi(AIST) |
| Assistant | Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] AI for material, material for AI |
| Sub Title (in English) | |
| Keyword(1) | AI |
| Keyword(2) | material informatics |
| Keyword(3) | packaging |
| Keyword(4) | bumping |
| 1st Author's Name | Shintaro Yamamichi |
| 1st Author's Affiliation | IBM Japan(IBM Japan) |
| Date | 2021-02-05 |
| Paper # | SDM2020-59 |
| Volume (vol) | vol.120 |
| Number (no) | SDM-359 |
| Page | pp.pp.19-22(SDM), |
| #Pages | 4 |
| Date of Issue | 2021-01-29 (SDM) |