Presentation 2021-02-05
Characteristic properties of Co?Zr alloy as a single?layer barrier
Yuki Yamada, Masataka Yahagi, Junichi Koike,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The purpose of this work is to replace the thick double layer of Ta liner and TaN barrier with a single layer of Co alloy having liner/barrier functions with thermally stable amorphous structure. The CALPHAD method was employed to calculate T0 curve as an indicator of amorphous stability in various Co alloy systems. Co-Zr system was predicted to be a potential candidate. Based on the calculated results, ultra-thin Co-Zr films were investigated for adhesion and barrier property. Cu/Co-Zr/SiO2 samples exhibited a good barrier property. However, the Co-Zr layer was decomposed at high temperature, which caused an increase in film resistivity due to Co diffusion to the Cu overlayer.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) LSI / Cu interconnect / diffusion barrier / CALPHAD method
Paper # SDM2020-56
Date of Issue 2021-01-29 (SDM)

Conference Information
Committee SDM
Conference Date 2021/2/5(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Hiroshige Hirano(TowerPartners Semiconductor)
Vice Chair Shunichiro Ohmi(Tokyo Inst. of Tech.)
Secretary Shunichiro Ohmi(AIST)
Assistant Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.)

Paper Information
Registration To Technical Committee on Silicon Device and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Characteristic properties of Co?Zr alloy as a single?layer barrier
Sub Title (in English)
Keyword(1) LSI
Keyword(2) Cu interconnect
Keyword(3) diffusion barrier
Keyword(4) CALPHAD method
1st Author's Name Yuki Yamada
1st Author's Affiliation Tohoku University(Tohoku Univ.)
2nd Author's Name Masataka Yahagi
2nd Author's Affiliation Tohoku University(Tohoku Univ.)
3rd Author's Name Junichi Koike
3rd Author's Affiliation Tohoku University(Tohoku Univ.)
Date 2021-02-05
Paper # SDM2020-56
Volume (vol) vol.120
Number (no) SDM-359
Page pp.pp.7-10(SDM),
#Pages 4
Date of Issue 2021-01-29 (SDM)