| Presentation | 2021-02-05 [Invited Talk] Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technology with 3D Redundancy Scheme Shinji Sugatani, Norio Chujo, Koji Sakui, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | An application of vertically replaceable memory block architecturescheme hereinafter referred to as “3D redundancy” for BBCube ispresented. BBCube is a high parallelism stacked dynamic random accessmemory (DRAM) system. Productivity of better than current known gooddie (KGD) stacking process will be shown, which leads to conclude thatwafer level fabrication is possible. Superior energy efficiency and heatconductance to the conventional high bandwidth memory (HBM) structurewill be shown, which has been resulted from lower TSV impedance andheat resistance by ultra-thinning technique of silicon, and bumplessfeature, combined with higher parallelism by denser through silicon vias(TSVs) of WOW technology and BBCube. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | SDM2020-61 |
| Date of Issue | 2021-01-29 (SDM) |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 2021/2/5(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Hiroshige Hirano(TowerPartners Semiconductor) |
| Vice Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
| Secretary | Shunichiro Ohmi(AIST) |
| Assistant | Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technology with 3D Redundancy Scheme |
| Sub Title (in English) | |
| Keyword(1) | |
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| 1st Author's Name | Shinji Sugatani |
| 1st Author's Affiliation | Tokyo Institute of Technology(Titech) |
| 2nd Author's Name | Norio Chujo |
| 2nd Author's Affiliation | Tokyo Institute of Technology(Titech) |
| 3rd Author's Name | Koji Sakui |
| 3rd Author's Affiliation | Tokyo Institute of Technology(Titech) |
| 4th Author's Name | Hiroyuki Ryoson |
| 4th Author's Affiliation | Tokyo Institute of Technology(Titech) |
| 5th Author's Name | Tomoji Nakamura |
| 5th Author's Affiliation | Tokyo Institute of Technology(Titech) |
| 6th Author's Name | Takayuki Ohba |
| 6th Author's Affiliation | Tokyo Institute of Technology(Titech) |
| Date | 2021-02-05 |
| Paper # | SDM2020-61 |
| Volume (vol) | vol.120 |
| Number (no) | SDM-359 |
| Page | pp.pp.27-32(SDM), |
| #Pages | 6 |
| Date of Issue | 2021-01-29 (SDM) |