| Presentation | 2021-02-05 [Invited Talk] Ru Area Selective Metal Capping and Wafer Surface Condition Control for sub-30nm Pitch Cu Damascene Interconnect Hirokazu Aizawa, Kaoru Maekawa, Kai-Hung Yu, Gyana Pattanaik, Gert Leusink, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | SDM2020-55 |
| Date of Issue | 2021-01-29 (SDM) |
| Conference Information | |
| Committee | SDM |
|---|---|
| Conference Date | 2021/2/5(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Hiroshige Hirano(TowerPartners Semiconductor) |
| Vice Chair | Shunichiro Ohmi(Tokyo Inst. of Tech.) |
| Secretary | Shunichiro Ohmi(AIST) |
| Assistant | Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
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| Language | ENG-JTITLE |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Ru Area Selective Metal Capping and Wafer Surface Condition Control for sub-30nm Pitch Cu Damascene Interconnect |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Hirokazu Aizawa |
| 1st Author's Affiliation | TEL Technology Center, America, LLC(TTCA) |
| 2nd Author's Name | Kaoru Maekawa |
| 2nd Author's Affiliation | TEL Technology Center, America, LLC(TTCA) |
| 3rd Author's Name | Kai-Hung Yu |
| 3rd Author's Affiliation | TEL Technology Center, America, LLC(TTCA) |
| 4th Author's Name | Gyana Pattanaik |
| 4th Author's Affiliation | TEL Technology Center, America, LLC(TTCA) |
| 5th Author's Name | Gert Leusink |
| 5th Author's Affiliation | TEL Technology Center, America, LLC(TTCA) |
| Date | 2021-02-05 |
| Paper # | SDM2020-55 |
| Volume (vol) | vol.120 |
| Number (no) | SDM-359 |
| Page | pp.pp.1-6(SDM), |
| #Pages | 6 |
| Date of Issue | 2021-01-29 (SDM) |