Presentation 2021-01-28
[Invited Talk] Vertical Gate-All-Around Tunnel FETs Using InGaAs Nanowire/Si with Core-Multishell Structure
Katsuhiro Tomioka, Hironori Gamo, Junichi Motohisa, Takashi Fukui,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We demonstrate vertical gate-all-around (VGAA) tunnel FETs (TFETs) using InGaAs core-multishell (CMS) nanowire (NW)/Si heterojunction. The CMS structure was composed of modulation-doped InGaAs/InP/AlInAs/InP multi layers. The device showed current enhancement with a steep subthreshold slope (SS). The minimum SS was 21 mV/decade. The device showed high transconductance efficiency of around 520/V, which exceed the theoretical maximum limit for conventional FETs (38.5/V).
Keyword(in Japanese) (See Japanese page)
Keyword(in English) tunnel FET / nanowire / III-V / vertical gate-all-around
Paper # SDM2020-52
Date of Issue 2021-01-21 (SDM)

Conference Information
Committee SDM
Conference Date 2021/1/28(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Hiroshige Hirano(TowerPartners Semiconductor)
Vice Chair Shunichiro Ohmi(Tokyo Inst. of Tech.)
Secretary Shunichiro Ohmi(AIST)
Assistant Taiji Noda(Panasonic) / Tomoyuki Suwa(Tohoku Univ.)

Paper Information
Registration To Technical Committee on Silicon Device and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] Vertical Gate-All-Around Tunnel FETs Using InGaAs Nanowire/Si with Core-Multishell Structure
Sub Title (in English)
Keyword(1) tunnel FET
Keyword(2) nanowire
Keyword(3) III-V
Keyword(4) vertical gate-all-around
1st Author's Name Katsuhiro Tomioka
1st Author's Affiliation Hokkaido University(Hokkaido Univ.)
2nd Author's Name Hironori Gamo
2nd Author's Affiliation Hokkaido University(Hokkaido Univ.)
3rd Author's Name Junichi Motohisa
3rd Author's Affiliation Hokkaido University(Hokkaido Univ.)
4th Author's Name Takashi Fukui
4th Author's Affiliation Hokkaido University(Hokkaido Univ.)
Date 2021-01-28
Paper # SDM2020-52
Volume (vol) vol.120
Number (no) SDM-352
Page pp.pp.13-16(SDM),
#Pages 4
Date of Issue 2021-01-21 (SDM)