Presentation 2021-03-02
A Study of Physical Cleaning Techniques for Semiconductor Devices
Yoshiyuki Seike, Tatsuo Mori,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Single-wafer physical wet cleaning using ultrasonic waves, sprays, and brushes is widely used in chip manufacturing. In this report, the principles of ultrasonic spray cleaning, high-pressure spray cleaning, and two-fluid spray are speculated from the viewpoint of macroscopic fluid dynamics, and their characteristics are experimentally confirmed using substrates coated with polystyrene latex (PSL) particles.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Semiconductor devices / Physical cleaning / Ultrasonic spray / Two-fluid spray / High-pressure spray
Paper # OME2020-27
Date of Issue 2021-02-22 (OME)

Conference Information
Committee OME / IEE-DEI
Conference Date 2021/3/1(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English) Organic Molecular Electronics
Chair Yutaka Majima(Tokyo Inst. of Tech.) / 早川 直樹(名古屋大学)
Vice Chair Toshiki Yamada(NICT)
Secretary Toshiki Yamada(Osaka Univ.) / (Tokyo Inst. of Tech.)
Assistant Toshihiko Kaji(Tokyo Univ. of Agriculture and Tech.) / Yoshiyuki Seike(Aichi Inst. of Tech.) / 早瀬 悠二(富士電機) / 村上 義信(豊橋技術科学大学)

Paper Information
Registration To Technical Committee on Organic Molecular Electronics / Technical Meeting on Dielectrics and Electrical Insulation
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study of Physical Cleaning Techniques for Semiconductor Devices
Sub Title (in English)
Keyword(1) Semiconductor devices
Keyword(2) Physical cleaning
Keyword(3) Ultrasonic spray
Keyword(4) Two-fluid spray
Keyword(5) High-pressure spray
1st Author's Name Yoshiyuki Seike
1st Author's Affiliation Aichi Institute of Technology(AIT)
2nd Author's Name Tatsuo Mori
2nd Author's Affiliation Aichi Institute of Technology(AIT)
Date 2021-03-02
Paper # OME2020-27
Volume (vol) vol.120
Number (no) OME-383
Page pp.pp.31-34(OME),
#Pages 4
Date of Issue 2021-02-22 (OME)