Presentation 2020-12-25
Measurement of Transient Temperature Change Process inside Silicon Wafer using Optical-Interference Contactless Thermometer(OICT)
Yuya Urasaki, Hiroaki Hanafusa, Seiichiro Higashi,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Optical-Interference Contactless Thermometer(OICT), which was originally developed by our laboratory, is a temperature measurement method that uses light interference. It has feature of a fast response, that temperature change inside the wafer can be seen, and that temperature of the wafer of surface can be measured from the backside of the wafer. Due to this advantage, we have tried to measure the temperature of the wafer of surface during the plasma process with high accuracy and to imitate the MOS transistor to visualize the temperature change inside the device. In order to apply OICT with such characteristics to other fields and to investigate the possibility of temperature measurement, in this study, we worked on improving the Thermal-Optical Coefficient(TOC) of Si. As a result, high accurate TOC measurement results were obtained. The absorption coefficient of Si as a function of temperature was also considered. Next, a continuous pulse current was applied to the Ni film formed on the Si wafer, and a steep temperature change was applied. It was measured with the temperature changed by Joule heat, and it was shown that heating and heat dissipation can be measured with high time resolution.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) OICT / TOC / Temperature measurement / High temperature
Paper #
Date of Issue

Conference Information
Committee OME
Conference Date 2020/12/25(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Okinawaken Seinen Kaikan
Topics (in Japanese) (See Japanese page)
Topics (in English) bio-technology, surface and interfacial phenomena, measurement and observation, electronics, and other researches relating these
Chair Yutaka Majima(Tokyo Inst. of Tech.)
Vice Chair Toshiki Yamada(NICT)
Secretary Toshiki Yamada(Osaka Univ.)
Assistant Toshihiko Kaji(Tokyo Univ. of Agriculture and Tech.) / Yoshiyuki Seike(Aichi Inst. of Tech.)

Paper Information
Registration To Technical Committee on Organic Molecular Electronics
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Measurement of Transient Temperature Change Process inside Silicon Wafer using Optical-Interference Contactless Thermometer(OICT)
Sub Title (in English)
Keyword(1) OICT
Keyword(2) TOC
Keyword(3) Temperature measurement
Keyword(4) High temperature
1st Author's Name Yuya Urasaki
1st Author's Affiliation Hiroshima University(Hiroshima Univ)
2nd Author's Name Hiroaki Hanafusa
2nd Author's Affiliation Hiroshima University(Hiroshima Univ)
3rd Author's Name Seiichiro Higashi
3rd Author's Affiliation Hiroshima University(Hiroshima Univ)
Date 2020-12-25
Paper #
Volume (vol) vol.120
Number (no) OME-307
Page pp.pp.-(),
#Pages
Date of Issue