| Presentation | 2020-12-11 Introduction of Power DEM (Device Embedded Module) technology & CSIPOS Shigehiro Hayashi, Haruki Sueyoshi, Kanta Nogita, Younggun HAN, Yoshihisa Katoh, Tadashi Suetsugu, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Embedded substrate / Power module / Power device / Printed circuit board / Cu electroplating |
| Paper # | EE2020-16,CPM2020-48,OME2020-1 |
| Date of Issue | 2020-12-04 (EE, CPM, OME) |
| Conference Information | |
| Committee | EE / OME / CPM |
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| Conference Date | 2020/12/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Tadashi Suetsugu(Fukuoka Univ.) / Yutaka Majima(Tokyo Inst. of Tech.) / Mayumi Takeyama(Kitami Inst. of Tech.) |
| Vice Chair | Hiroo Sekiya(Chiba Univ.) / Keiichi Hirose(NTT Facilities) / Toshiki Yamada(NICT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) |
| Secretary | Hiroo Sekiya(Sojo Univ.) / Keiichi Hirose(Nagasaki Inst. of Applied Science) / Toshiki Yamada(Osaka Univ.) / Yuichi Nakamura(Tokyo Inst. of Tech.) |
| Assistant | Yuu Yonezawa(FUJITSU Advanced Technologies) / Yudai Furukawa(Fukuoka Univ.) / Kazufumi Yuasa(NTT Facilities) / Toshihiko Kaji(Tokyo Univ. of Agriculture and Tech.) / Yoshiyuki Seike(Aichi Inst. of Tech.) / Yasuo Kimura(Tokyo Univ. of Tech.) / Tomoaki Terasako(Ehime Univ.) / Fumihiko Hirose(Yamagata Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Energy Engineering in Electronics and Communications / Technical Committee on Organic Molecular Electronics / Technical Committee on Component Parts and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Introduction of Power DEM (Device Embedded Module) technology & CSIPOS |
| Sub Title (in English) | |
| Keyword(1) | Embedded substrate |
| Keyword(2) | Power module |
| Keyword(3) | Power device |
| Keyword(4) | Printed circuit board |
| Keyword(5) | Cu electroplating |
| 1st Author's Name | Shigehiro Hayashi |
| 1st Author's Affiliation | Fukuoka Industry, Science & Technology Foundation(Fukuoka IST) |
| 2nd Author's Name | Haruki Sueyoshi |
| 2nd Author's Affiliation | Fukuoka Industry, Science & Technology Foundation(Fukuoka IST) |
| 3rd Author's Name | Kanta Nogita |
| 3rd Author's Affiliation | Fukuoka Industry, Science & Technology Foundation(Fukuoka IST) |
| 4th Author's Name | Younggun HAN |
| 4th Author's Affiliation | Center of System Integration Platform Organization Stan- dards, Fukuoka University(CSIPOS) |
| 5th Author's Name | Yoshihisa Katoh |
| 5th Author's Affiliation | Center of System Integration Platform Organization Stan- dards, Fukuoka University(CSIPOS) |
| 6th Author's Name | Tadashi Suetsugu |
| 6th Author's Affiliation | Department of Electronics Engineering and Computer Sci- ence, Fukuoka University(ukuoka Univ.) |
| Date | 2020-12-11 |
| Paper # | EE2020-16,CPM2020-48,OME2020-1 |
| Volume (vol) | vol.120 |
| Number (no) | EE-283,CPM-284,OME-285 |
| Page | pp.pp.1-6(EE), pp.1-6(CPM), pp.1-6(OME), |
| #Pages | 6 |
| Date of Issue | 2020-12-04 (EE, CPM, OME) |