Presentation 2020-12-11
Introduction of Power DEM (Device Embedded Module) technology & CSIPOS
Shigehiro Hayashi, Haruki Sueyoshi, Kanta Nogita, Younggun HAN, Yoshihisa Katoh, Tadashi Suetsugu,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Embedded substrate / Power module / Power device / Printed circuit board / Cu electroplating
Paper # EE2020-16,CPM2020-48,OME2020-1
Date of Issue 2020-12-04 (EE, CPM, OME)

Conference Information
Committee EE / OME / CPM
Conference Date 2020/12/11(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Tadashi Suetsugu(Fukuoka Univ.) / Yutaka Majima(Tokyo Inst. of Tech.) / Mayumi Takeyama(Kitami Inst. of Tech.)
Vice Chair Hiroo Sekiya(Chiba Univ.) / Keiichi Hirose(NTT Facilities) / Toshiki Yamada(NICT) / Yuichi Nakamura(Toyohashi Univ. of Tech.)
Secretary Hiroo Sekiya(Sojo Univ.) / Keiichi Hirose(Nagasaki Inst. of Applied Science) / Toshiki Yamada(Osaka Univ.) / Yuichi Nakamura(Tokyo Inst. of Tech.)
Assistant Yuu Yonezawa(FUJITSU Advanced Technologies) / Yudai Furukawa(Fukuoka Univ.) / Kazufumi Yuasa(NTT Facilities) / Toshihiko Kaji(Tokyo Univ. of Agriculture and Tech.) / Yoshiyuki Seike(Aichi Inst. of Tech.) / Yasuo Kimura(Tokyo Univ. of Tech.) / Tomoaki Terasako(Ehime Univ.) / Fumihiko Hirose(Yamagata Univ.)

Paper Information
Registration To Technical Committee on Energy Engineering in Electronics and Communications / Technical Committee on Organic Molecular Electronics / Technical Committee on Component Parts and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Introduction of Power DEM (Device Embedded Module) technology & CSIPOS
Sub Title (in English)
Keyword(1) Embedded substrate
Keyword(2) Power module
Keyword(3) Power device
Keyword(4) Printed circuit board
Keyword(5) Cu electroplating
1st Author's Name Shigehiro Hayashi
1st Author's Affiliation Fukuoka Industry, Science & Technology Foundation(Fukuoka IST)
2nd Author's Name Haruki Sueyoshi
2nd Author's Affiliation Fukuoka Industry, Science & Technology Foundation(Fukuoka IST)
3rd Author's Name Kanta Nogita
3rd Author's Affiliation Fukuoka Industry, Science & Technology Foundation(Fukuoka IST)
4th Author's Name Younggun HAN
4th Author's Affiliation Center of System Integration Platform Organization Stan- dards, Fukuoka University(CSIPOS)
5th Author's Name Yoshihisa Katoh
5th Author's Affiliation Center of System Integration Platform Organization Stan- dards, Fukuoka University(CSIPOS)
6th Author's Name Tadashi Suetsugu
6th Author's Affiliation Department of Electronics Engineering and Computer Sci- ence, Fukuoka University(ukuoka Univ.)
Date 2020-12-11
Paper # EE2020-16,CPM2020-48,OME2020-1
Volume (vol) vol.120
Number (no) EE-283,CPM-284,OME-285
Page pp.pp.1-6(EE), pp.1-6(CPM), pp.1-6(OME),
#Pages 6
Date of Issue 2020-12-04 (EE, CPM, OME)