Presentation 2020-10-23
A Study on a New Structural Microstrip Balun and Its Test Circuit.
Kazuto Oshima, Ryosuke Suga, Tomoki Uwano, Osamu Hashimoto,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have proposed a balun with a simple structure that has a slitted ground of the microstrip line. In this study, we proposed the evaluation structure of the balun for connecting the microstrip line and the parallel two lines and the widening of the operating frequency using the electromagnetic simulator. As a result of evaluating the balun using the evaluation structure, it was confirmed that a wide band characteristic with a 20 dB relative bandwidth of common mode rejection ratio was 90 %.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Balun / Microstrip line / slit / broadband / CMRR
Paper # EMCJ2020-37,MW2020-51,EST2020-39
Date of Issue 2020-10-15 (EMCJ, MW, EST)

Conference Information
Committee MW / EST / EMCJ / IEE-EMC
Conference Date 2020/10/22(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Online
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Yoshinori Kogami(Utsunomiya Univ.) / Shinichiro Ohnuki(Nihon Univ.) / Kensei Oh(Nagoya Inst. of Tech.)
Vice Chair Tadashi Kawai(Univ. of Hyogo) / Kensuke Okubo(Okayama Prefectural Univ.) / Shintaro Shinjo(Mitsubishi Electric) / Masayuki Kimishima(Advantest) / Jun Shibayama(Hosei Univ.) / Yasuhide Tsuji(Muroran Inst. of Tech.) / Atsuhiro Nishikata(Tokyo Inst. of Tech.)
Secretary Tadashi Kawai(Fujitsu Labs.) / Kensuke Okubo(Saitama Univ.) / Shintaro Shinjo(Aoyama Gakuin Univ.) / Masayuki Kimishima(ENRI) / Jun Shibayama(Denso) / Yasuhide Tsuji(NAIST) / Atsuhiro Nishikata
Assistant Kyoya Takano(Tokyo Univ. of Science) / Naoki Hasegawa(Softbank) / Hidenori Ishibashi(MitsubishiElectric) / Seiya Kishimoto(Nihon Univ.) / Nami Sasaki(Seiwa Electric MFG) / Hiroyoshi Shida(Tokin EMC Engineering) / Sho Muroga(Akita Univ.)

Paper Information
Registration To Technical Committee on Microwaves / Technical Committee on Electronics Simulation Technology / Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study on a New Structural Microstrip Balun and Its Test Circuit.
Sub Title (in English)
Keyword(1) Balun
Keyword(2) Microstrip line
Keyword(3) slit
Keyword(4) broadband
Keyword(5) CMRR
1st Author's Name Kazuto Oshima
1st Author's Affiliation Aoyama Gakuin University(Aoyama Gakuin Univ.)
2nd Author's Name Ryosuke Suga
2nd Author's Affiliation Aoyama Gakuin University(Aoyama Gakuin Univ.)
3rd Author's Name Tomoki Uwano
3rd Author's Affiliation Office Uwano(Office Uwano)
4th Author's Name Osamu Hashimoto
4th Author's Affiliation Aoyama Gakuin University(Aoyama Gakuin Univ.)
Date 2020-10-23
Paper # EMCJ2020-37,MW2020-51,EST2020-39
Volume (vol) vol.120
Number (no) EMCJ-199,MW-200,EST-201
Page pp.pp.72-76(EMCJ), pp.72-76(MW), pp.72-76(EST),
#Pages 5
Date of Issue 2020-10-15 (EMCJ, MW, EST)