| Presentation | 2020-06-18 Thermal transient analysis of the heat generation and design of temperature control circuit in three-dimensional stacked chip Tomoaki Oikawa, Kimiyoshi Usami, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI chips. In the three-dimensional stacking technology, it is possible to improve the degree of integration of the LSI regardless of the miniaturization of the manufacturing process of the LSI. A serious problem in three-dimensional stacked LSI lies in the thermal problem. This problem occurs because the heat generated inside the chip continues to stay inside the chip without being released outside. In this research, in order to solve this problem, we designed a power line select circuit to control heat generation in the chip. In addition, we measured how the heat generated inside the 3D stacked chip is transmitted by simulation using 3D numerical fluid dynamics software. Simulation results demonstrated that power reduction by dynamic voltage scaling at the circuit near the chip edge is more effective than that at the center of the chip. This trend is more significant in the chips stacked upper side. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | 3D stacked LSI / Thermal Monitor / Heat generation / Heat dissipation / Thermal transient analysis / Heat treatment |
| Paper # | CAS2020-9,VLD2020-9,SIP2020-25,MSS2020-9 |
| Date of Issue | 2020-06-11 (CAS, VLD, SIP, MSS) |
| Conference Information | |
| Committee | MSS / CAS / SIP / VLD |
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| Conference Date | 2020/6/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Online Meetig |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Shigemasa Takai(Osaka Univ.) / Yasuhiro Takashima(Univ. of Kitakyushu) / Naoyuki Aikawa(TUS) / Daisuke Fukuda(Fujitsu Labs.) |
| Vice Chair | Atsuo Ozaki(Osaka Inst. of Tech.) / Hiroki Sato(Sony LSI Design) / Kazunori Hayashi(Osaka City Univ) / Yukihiro Bandou(NTT) / Kazutoshi Kobayashi(Kyoto Inst. of Tech.) |
| Secretary | Atsuo Ozaki(Setsunan Univ.) / Hiroki Sato(Hokkaido Univ.) / Kazunori Hayashi(Yamanashi Univ.) / Yukihiro Bandou(Sony LSI Design) / Kazutoshi Kobayashi(Hiroshima Univ.) |
| Assistant | Naoki Hayashi(Osaka Univ.) / Motoi Yamaguchi(TECHNOPRO) / Yohei Nakamura(Hitachi) / Kenjiro Sugimoto(Waseda Univ.) / Kazuki Ikeda(Hitachi) |
| Paper Information | |
| Registration To | Technical Committee on Mathematical Systems Science and its applications / Technical Committee on Circuits and Systems / Technical Committee on Signal Processing / Technical Committee on VLSI Design Technologies |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Thermal transient analysis of the heat generation and design of temperature control circuit in three-dimensional stacked chip |
| Sub Title (in English) | |
| Keyword(1) | 3D stacked LSI |
| Keyword(2) | Thermal Monitor |
| Keyword(3) | Heat generation |
| Keyword(4) | Heat dissipation |
| Keyword(5) | |
| Keyword(6) | Thermal transient analysis |
| Keyword(7) | Heat treatment |
| 1st Author's Name | Tomoaki Oikawa |
| 1st Author's Affiliation | Shibaura Institute of Technology(Shibaura Inst. of Tech.) |
| 2nd Author's Name | Kimiyoshi Usami |
| 2nd Author's Affiliation | Shibaura Institute of Technology(Shibaura Inst. of Tech.) |
| Date | 2020-06-18 |
| Paper # | CAS2020-9,VLD2020-9,SIP2020-25,MSS2020-9 |
| Volume (vol) | vol.120 |
| Number (no) | CAS-65,VLD-66,SIP-67,MSS-68 |
| Page | pp.pp.47-52(CAS), pp.47-52(VLD), pp.47-52(SIP), pp.47-52(MSS), |
| #Pages | 6 |
| Date of Issue | 2020-06-11 (CAS, VLD, SIP, MSS) |