| Presentation | 2020-02-27 Detecting Resistive-Open Defects of Power TSVs in 3D-ICs Koutaro Hachiya, Atsushi Kurokawa, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A method is proposed which detects resistive-open defects of power TSVs in PDNs by measuring resistance between power micro-bumps. Utilizing the monotonically increasing property of the measured resistance between power micro-bumps when the resistance of TSV under test increases, the method defines the minimum defective resistance $R_{¥it min}$ of TSVs and uses it as the resistance of defective TSV in statistical fault simulations. Simulation results of a 3D-IC example with two dies show that the proposed method can detect resistive opens although defect coverage is decreased when $R_{¥it min}$ is decreased. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | 3D-IC / TSV / testing power distribution network / resistive open defect |
| Paper # | CAS2019-104,CS2019-104 |
| Date of Issue | 2020-02-20 (CAS, CS) |
| Conference Information | |
| Committee | CS / CAS |
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| Conference Date | 2020/2/27(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Hidenori Nakazato(Waseda Univ.) / Taizo Yamawaki(Hitachi) |
| Vice Chair | Jun Terada(NTT) / Yasuhiro Takashima(Univ. of Kitakyushu) |
| Secretary | Jun Terada(Waseda Univ.) / Yasuhiro Takashima(Mitsubishi Electric) |
| Assistant | Kazutaka Hara(NTT) / Hiroyuki Saito(OKI) / Hiroki Sato(Sony LSI Design) / Motoi Yamaguchi(Renesas Electronics) |
| Paper Information | |
| Registration To | Technical Committee on Communication Systems / Technical Committee on Circuits and Systems |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Detecting Resistive-Open Defects of Power TSVs in 3D-ICs |
| Sub Title (in English) | |
| Keyword(1) | 3D-IC |
| Keyword(2) | TSV |
| Keyword(3) | testing power distribution network |
| Keyword(4) | resistive open defect |
| 1st Author's Name | Koutaro Hachiya |
| 1st Author's Affiliation | Teikyo Heisei University(Teikyo Heisei Univ.) |
| 2nd Author's Name | Atsushi Kurokawa |
| 2nd Author's Affiliation | Hirosaki University(Hirosaki Univ.) |
| Date | 2020-02-27 |
| Paper # | CAS2019-104,CS2019-104 |
| Volume (vol) | vol.119 |
| Number (no) | CAS-423,CS-424 |
| Page | pp.pp.37-41(CAS), pp.37-41(CS), |
| #Pages | 5 |
| Date of Issue | 2020-02-20 (CAS, CS) |