| Presentation | 2019-11-27 30GHz bandwidth optical receiver module using flip chip assembly with micro solder ball Atsunobu Ohta, Nobuyoshi Kawaguchi, Koudai Suzuki, Atsushi Kanayama, Manabu Wakabayashi, Hachinori Ogawa, Toshio Kawai, Tetsuya Kawanishi, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | MWP2019-47 |
| Date of Issue | 2019-11-20 (MWP) |
| Conference Information | |
| Committee | MWP |
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| Conference Date | 2019/11/27(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Deviceｓ |
| Chair | Naoto Yoshimoto(Chitose Inst. of Science and Tech.) |
| Vice Chair | Akihiko Hirata(Chiba Inst. of Tech.) |
| Secretary | Akihiko Hirata(Yazaki) |
| Assistant | Kensuke Ikeda(CRIEPI) / Li Yi(Osaka Univ.) / Takashi Yamada(NTT) |
| Paper Information | |
| Registration To | Technical Committee on Microwave and Millimeter-wave Photonics |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 30GHz bandwidth optical receiver module using flip chip assembly with micro solder ball |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Atsunobu Ohta |
| 1st Author's Affiliation | KYOTO SEMICONDUCTOR Co., Ltd.(KYOSEMI) |
| 2nd Author's Name | Nobuyoshi Kawaguchi |
| 2nd Author's Affiliation | KYOTO SEMICONDUCTOR Co., Ltd.(KYOSEMI) |
| 3rd Author's Name | Koudai Suzuki |
| 3rd Author's Affiliation | KYOTO SEMICONDUCTOR Co., Ltd.(KYOSEMI) |
| 4th Author's Name | Atsushi Kanayama |
| 4th Author's Affiliation | KYOTO SEMICONDUCTOR Co., Ltd.(KYOSEMI) |
| 5th Author's Name | Manabu Wakabayashi |
| 5th Author's Affiliation | KYOTO SEMICONDUCTOR Co., Ltd.(KYOSEMI) |
| 6th Author's Name | Hachinori Ogawa |
| 6th Author's Affiliation | KYOTO SEMICONDUCTOR Co., Ltd.(KYOSEMI) |
| 7th Author's Name | Toshio Kawai |
| 7th Author's Affiliation | KYOTO SEMICONDUCTOR Co., Ltd.(KYOSEMI) |
| 8th Author's Name | Tetsuya Kawanishi |
| 8th Author's Affiliation | Waseda University(Waseda Univ.) |
| Date | 2019-11-27 |
| Paper # | MWP2019-47 |
| Volume (vol) | vol.119 |
| Number (no) | MWP-312 |
| Page | pp.pp.23-23(MWP), |
| #Pages | 1 |
| Date of Issue | 2019-11-20 (MWP) |