| Presentation | 2019-11-15 Evaluation of Inter-chip Inductive Coupling Wireless Communication Technology Hideto Kayashima, Takuya Kojima, Hayate Okuhara, Tsunaaki Shidei, Hideharu Amano, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Building block computing systems, which is one of the three-dimensional stacked LSI systems, use a wireless communication interface TCI (Through Chip Interface) using electromagnetic induction between coils as an inter-chip communication technology. In order to measure the operating characteristics of this TCI, we evaluated the characteristics using an operation veri cation chip TCI Tester. As a result, TCI operates stably with high reliability, but its performance is lower than the design value. Possible causes include power grid degradation when incorporating as IP, and the power I/O is poor due to the stacking, and the Renesas SOTB process is changed. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Building block computing system / ThruChip Interface / 3-D stacked VLSIs |
| Paper # | CPSY2019-48 |
| Date of Issue | 2019-11-07 (CPSY) |
| Conference Information | |
| Committee | VLD / DC / CPSY / RECONF / ICD / IE / IPSJ-SLDM / IPSJ-EMB / IPSJ-ARC |
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| Conference Date | 2019/11/13(3days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Ehime Prefecture Gender Equality Center |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Design Gaia 2019 -New Field of VLSI Design- |
| Chair | Nozomu Togawa(Waseda Univ.) / Satoshi Fukumoto(Tokyo Metropolitan Univ.) / Hidetsugu Irie(Univ. of Tokyo) / Yuichiro Shibata(Nagasaki Univ.) / Makoto Nagata(Kobe Univ.) / Hideaki Kimata(NTT) / Yutaka Tamiya(Fujitsu Lab.) / / Hiroshi Inoue(Kyushu Univ.) |
| Vice Chair | Daisuke Fukuda(Fujitsu Labs.) / Hiroshi Takahashi(Ehime Univ.) / Michihiro Koibuchi(NII) / Kota Nakajima(Fujitsu Lab.) / Kentaro Sano(RIKEN) / Yoshiki Yamaguchi(Tsukuba Univ.) / Masafumi Takahashi(Toshiba-memory) / Kazuya Kodama(NII) / Keita Takahashi(Nagoya Univ.) |
| Secretary | Daisuke Fukuda(Univ. of Aizu) / Hiroshi Takahashi(Hitachi) / Michihiro Koibuchi(Nihon Univ.) / Kota Nakajima(Chiba Univ.) / Kentaro Sano(Nagoya Inst. of Tech.) / Yoshiki Yamaguchi(Hokkaido Univ.) / Masafumi Takahashi(Hiroshima City Univ.) / Kazuya Kodama(e-trees.Japan) / Keita Takahashi(Tohoku Univ.) / (Socionext) / (NTT) / (NHK) |
| Assistant | Kazuki Ikeda(Hitachi) / / Eiji Arima(Univ. of Tokyo) / Shugo Ogawa(Hitachi) / Yuuki Kobayashi(NEC) / Hiroki Nakahara(Tokyo Inst. of Tech.) / Tetsuya Hirose(Osaka Univ.) / Koji Nii(Floadia) / Takeshi Kuboki(Kyushu Univ.) / Kyohei Unno(KDDI Research) / Norishige Fukushima(Nagoya Inst. of Tech.) |
| Paper Information | |
| Registration To | Technical Committee on VLSI Design Technologies / Technical Committee on Dependable Computing / Technical Committee on Computer Systems / Technical Committee on Reconfigurable Systems / Technical Committee on Integrated Circuits and Devices / Technical Committee on Image Engineering / Special Interest Group on System and LSI Design Methodology / Special Interest Group on Embedded Systems / Special Interest Group on System Architecture |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Evaluation of Inter-chip Inductive Coupling Wireless Communication Technology |
| Sub Title (in English) | |
| Keyword(1) | Building block computing system |
| Keyword(2) | ThruChip Interface |
| Keyword(3) | 3-D stacked VLSIs |
| 1st Author's Name | Hideto Kayashima |
| 1st Author's Affiliation | Keio University(Keio Univ.) |
| 2nd Author's Name | Takuya Kojima |
| 2nd Author's Affiliation | Keio University(Keio Univ.) |
| 3rd Author's Name | Hayate Okuhara |
| 3rd Author's Affiliation | Keio University(Keio Univ.) |
| 4th Author's Name | Tsunaaki Shidei |
| 4th Author's Affiliation | Keio University(Keio Univ.) |
| 5th Author's Name | Hideharu Amano |
| 5th Author's Affiliation | Keio University(Keio Univ.) |
| Date | 2019-11-15 |
| Paper # | CPSY2019-48 |
| Volume (vol) | vol.119 |
| Number (no) | CPSY-286 |
| Page | pp.pp.59-64(CPSY), |
| #Pages | 6 |
| Date of Issue | 2019-11-07 (CPSY) |