| Presentation | 2019-10-25 Analysis of Crosstalk Between Lines on Printed Circuit Board with 3 Layers Teruo Tobana, Yoji Isota, Masashi Kawakami, Akimoto Kohei, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Recently, by advance of miniaturization of electronic devices, a ground of a printed circuit board is tend to be small and complicated and the ground may have some defects, such as connectors or clearance halls of vias. In this paper, we calculated electromagnetic coupling between microstrip lines on different layers in 3 layers printed circuit board with a narrow ground slot which has finite length using multi-conductor transmission lines method. In order to calculate some electromagnetic coupling, per-unit-length parameters between the slot and the microstrip line are calculated using the spectral domain method. Finally, we showed that near-end electromagnetic coupling results using MTL method agree as a trend with the FDTD method results and measured results but far-end coupling results do not agree. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | coupling / multiconductor-transmission-line / ground slot / 3 layers PCB |
| Paper # | EMCJ2019-69,MW2019-98,EST2019-77 |
| Date of Issue | 2019-10-17 (EMCJ, MW, EST) |
| Conference Information | |
| Committee | EMCJ / MW / EST / IEE-EMC |
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| Conference Date | 2019/10/24(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tohoku Gakuin University(Conf. Room 2, Eng. Bldg. 1) |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | EMC, Microwave, Electromagnetic field simulation. |
| Chair | Kensei Oh(Nagoya Inst. of Tech.) / Yoshinori Kogami(Utsunomiya Univ.) / Akimasa Hirata(Nagoya Inst. of Tech.) / Ken-ichi Yamazaki(電中研) |
| Vice Chair | Atsuhiro Nishikata(Tokyo Inst. of Tech.) / Tadashi Kawai(Univ. of Hyogo) / Kensuke Okubo(Okayama Prefectural Univ.) / Shintaro Shinjo(Mitsubishi Electric) / Shinichiro Ohnuki(Nihon Univ.) / Masayuki Kimishima(Advantest) / Jun Shibayama(Hosei Univ.) |
| Secretary | Atsuhiro Nishikata(Tokyo Inst. of Tech.) / Tadashi Kawai(Denso) / Kensuke Okubo(Utsunomiya Univ.) / Shintaro Shinjo(Fujitsu Labs.) / Shinichiro Ohnuki(National Inst. of Tech.,Sendai College) / Masayuki Kimishima(Aoyama Gakuin Univ.) / Jun Shibayama(東北学院大) / (鉄道総研) |
| Assistant | Nami Sasaki(Seiwa Electric MFG) / Hiroyoshi Shida(Tokin EMC Engineering) / Sho Muroga(Akita Univ.) / Satoshi Yoshida(Kagoshima Univ.) / Kyoya Takano(Tokyo Univ. of Science) / Takahiro Ito(Nagoya Inst. of Tech.) / Kazuhiro Fujita(Fujitsu) / Takaaki Ibuchi(阪大) |
| Paper Information | |
| Registration To | Technical Committee on Electromagnetic Compatibility / Technical Committee on Microwaves / Technical Committee on Electronics Simulation Technology / Technical Meeting on Electromagnetic Compatibility |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Analysis of Crosstalk Between Lines on Printed Circuit Board with 3 Layers |
| Sub Title (in English) | |
| Keyword(1) | coupling |
| Keyword(2) | multiconductor-transmission-line |
| Keyword(3) | ground slot |
| Keyword(4) | 3 layers PCB |
| 1st Author's Name | Teruo Tobana |
| 1st Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
| 2nd Author's Name | Yoji Isota |
| 2nd Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
| 3rd Author's Name | Masashi Kawakami |
| 3rd Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
| 4th Author's Name | Akimoto Kohei |
| 4th Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
| Date | 2019-10-25 |
| Paper # | EMCJ2019-69,MW2019-98,EST2019-77 |
| Volume (vol) | vol.119 |
| Number (no) | EMCJ-241,MW-242,EST-243 |
| Page | pp.pp.183-186(EMCJ), pp.183-186(MW), pp.183-186(EST), |
| #Pages | 4 |
| Date of Issue | 2019-10-17 (EMCJ, MW, EST) |