| Presentation | 2019-10-24 [Invited Talk] NiAl as Cu alternative for ultrasmall feature sizes Linghan Chen, Junichi Koike, Daisuke Ando, Yuji Sutou, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Conventional Cu interconnect will suffer from a great line resistivity increase due to aggressive downscaling of the dimensions of future large-scale-integrated (LSI) devices. In this report, the possibility of NiAl as a Cu alternative for highly scaled interconnections is investigated, with interfacial reaction, diffusion-barrier property, time-dependent-dielectric-breakdown (TDDB) reliability and thickness/linewidth-dependent resistivity change being examined. The results demonstrate that NiAl is a promising interconnect material that can be used without liner or barrier layer for linewidths below 7?nm. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | InterconnectNiAlCu alternativeLiner- and Barrier-freeReliability |
| Paper # | SDM2019-59 |
| Date of Issue | 2019-10-16 (SDM) |
| Conference Information | |
| Committee | SDM |
|---|---|
| Conference Date | 2019/10/23(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Niche, Tohoku Univ. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Process Science and New Process Technology |
| Chair | Takahiro Shinada(Tohoku Univ.) |
| Vice Chair | Hiroshige Hirano(TowerJazz Panasonic) |
| Secretary | Hiroshige Hirano(Shizuoka Univ.) |
| Assistant | Takahiro Mori(AIST) / Nobuaki Kobayashi(Nihon Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] NiAl as Cu alternative for ultrasmall feature sizes |
| Sub Title (in English) | |
| Keyword(1) | InterconnectNiAlCu alternativeLiner- and Barrier-freeReliability |
| 1st Author's Name | Linghan Chen |
| 1st Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 2nd Author's Name | Junichi Koike |
| 2nd Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 3rd Author's Name | Daisuke Ando |
| 3rd Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 4th Author's Name | Yuji Sutou |
| 4th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| Date | 2019-10-24 |
| Paper # | SDM2019-59 |
| Volume (vol) | vol.119 |
| Number (no) | SDM-239 |
| Page | pp.pp.29-33(SDM), |
| #Pages | 5 |
| Date of Issue | 2019-10-16 (SDM) |