Presentation | 2019-10-24 [Invited Talk] NiAl as Cu alternative for ultrasmall feature sizes Linghan Chen, Junichi Koike, Daisuke Ando, Yuji Sutou, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Conventional Cu interconnect will suffer from a great line resistivity increase due to aggressive downscaling of the dimensions of future large-scale-integrated (LSI) devices. In this report, the possibility of NiAl as a Cu alternative for highly scaled interconnections is investigated, with interfacial reaction, diffusion-barrier property, time-dependent-dielectric-breakdown (TDDB) reliability and thickness/linewidth-dependent resistivity change being examined. The results demonstrate that NiAl is a promising interconnect material that can be used without liner or barrier layer for linewidths below 7?nm. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | InterconnectNiAlCu alternativeLiner- and Barrier-freeReliability |
Paper # | SDM2019-59 |
Date of Issue | 2019-10-16 (SDM) |
Conference Information | |
Committee | SDM |
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Conference Date | 2019/10/23(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Niche, Tohoku Univ. |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Process Science and New Process Technology |
Chair | Takahiro Shinada(Tohoku Univ.) |
Vice Chair | Hiroshige Hirano(TowerJazz Panasonic) |
Secretary | Hiroshige Hirano(Shizuoka Univ.) |
Assistant | Takahiro Mori(AIST) / Nobuaki Kobayashi(Nihon Univ.) |
Paper Information | |
Registration To | Technical Committee on Silicon Device and Materials |
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Language | ENG |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | [Invited Talk] NiAl as Cu alternative for ultrasmall feature sizes |
Sub Title (in English) | |
Keyword(1) | InterconnectNiAlCu alternativeLiner- and Barrier-freeReliability |
1st Author's Name | Linghan Chen |
1st Author's Affiliation | Tohoku University(Tohoku Univ.) |
2nd Author's Name | Junichi Koike |
2nd Author's Affiliation | Tohoku University(Tohoku Univ.) |
3rd Author's Name | Daisuke Ando |
3rd Author's Affiliation | Tohoku University(Tohoku Univ.) |
4th Author's Name | Yuji Sutou |
4th Author's Affiliation | Tohoku University(Tohoku Univ.) |
Date | 2019-10-24 |
Paper # | SDM2019-59 |
Volume (vol) | vol.119 |
Number (no) | SDM-239 |
Page | pp.pp.29-33(SDM), |
#Pages | 5 |
Date of Issue | 2019-10-16 (SDM) |