| Presentation | 2019-10-25 Noise Suppression with Magnetic Composite Sheets in IC chip packaging and Improvements of Wireless Communication Performance Koh Watanabe, Kosuke Jike, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata, Akihiro Takahashi, Yasunori Miyazawa, Masahiro Yamaguchi, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | EMCJ2019-67,MW2019-96,EST2019-75 |
| Date of Issue | 2019-10-17 (EMCJ, MW, EST) |
| Conference Information | |
| Committee | EMCJ / MW / EST / IEE-EMC |
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| Conference Date | 2019/10/24(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tohoku Gakuin University(Conf. Room 2, Eng. Bldg. 1) |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | EMC, Microwave, Electromagnetic field simulation. |
| Chair | Kensei Oh(Nagoya Inst. of Tech.) / Yoshinori Kogami(Utsunomiya Univ.) / Akimasa Hirata(Nagoya Inst. of Tech.) / Ken-ichi Yamazaki(電中研) |
| Vice Chair | Atsuhiro Nishikata(Tokyo Inst. of Tech.) / Tadashi Kawai(Univ. of Hyogo) / Kensuke Okubo(Okayama Prefectural Univ.) / Shintaro Shinjo(Mitsubishi Electric) / Shinichiro Ohnuki(Nihon Univ.) / Masayuki Kimishima(Advantest) / Jun Shibayama(Hosei Univ.) |
| Secretary | Atsuhiro Nishikata(Tokyo Inst. of Tech.) / Tadashi Kawai(Denso) / Kensuke Okubo(Utsunomiya Univ.) / Shintaro Shinjo(Fujitsu Labs.) / Shinichiro Ohnuki(National Inst. of Tech.,Sendai College) / Masayuki Kimishima(Aoyama Gakuin Univ.) / Jun Shibayama(東北学院大) / (鉄道総研) |
| Assistant | Nami Sasaki(Seiwa Electric MFG) / Hiroyoshi Shida(Tokin EMC Engineering) / Sho Muroga(Akita Univ.) / Satoshi Yoshida(Kagoshima Univ.) / Kyoya Takano(Tokyo Univ. of Science) / Takahiro Ito(Nagoya Inst. of Tech.) / Kazuhiro Fujita(Fujitsu) / Takaaki Ibuchi(阪大) |
| Paper Information | |
| Registration To | Technical Committee on Electromagnetic Compatibility / Technical Committee on Microwaves / Technical Committee on Electronics Simulation Technology / Technical Meeting on Electromagnetic Compatibility |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Noise Suppression with Magnetic Composite Sheets in IC chip packaging and Improvements of Wireless Communication Performance |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Koh Watanabe |
| 1st Author's Affiliation | Kobe University(Kobe Univ.) |
| 2nd Author's Name | Kosuke Jike |
| 2nd Author's Affiliation | Kobe University(Kobe Univ.) |
| 3rd Author's Name | Satoshi Tanaka |
| 3rd Author's Affiliation | Kobe University(Kobe Univ.) |
| 4th Author's Name | Noriyuki Miura |
| 4th Author's Affiliation | Kobe University(Kobe Univ.) |
| 5th Author's Name | Makoto Nagata |
| 5th Author's Affiliation | Kobe University(Kobe Univ.) |
| 6th Author's Name | Akihiro Takahashi |
| 6th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 7th Author's Name | Yasunori Miyazawa |
| 7th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 8th Author's Name | Masahiro Yamaguchi |
| 8th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| Date | 2019-10-25 |
| Paper # | EMCJ2019-67,MW2019-96,EST2019-75 |
| Volume (vol) | vol.119 |
| Number (no) | EMCJ-241,MW-242,EST-243 |
| Page | pp.pp.175-178(EMCJ), pp.175-178(MW), pp.175-178(EST), |
| #Pages | 4 |
| Date of Issue | 2019-10-17 (EMCJ, MW, EST) |