| Presentation | 2019-08-07 [Invited Talk] Ultrafast Photonics Packaging using Room Temperature Bonding Ryo Takigawa, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
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| Conference Information | |
| Committee | SDM / ICD / ITE-IST |
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| Conference Date | 2019/8/7(3days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Hokkaido Univ., Graduate School /Faculty of Information Science and |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications |
| Chair | Takahiro Shinada(Tohoku Univ.) / Makoto Nagata(Kobe Univ.) / 秋田 純一(金沢大)) |
| Vice Chair | Hiroshige Hirano(TowerJazz Panasonic) / Masafumi Takahashi(Toshiba-memory) / 廣瀬 裕(パナソニック) |
| Secretary | Hiroshige Hirano(Shizuoka Univ.) / Masafumi Takahashi(TOSHIBA MEMORY) / 廣瀬 裕(Tohoku Univ.) |
| Assistant | Takahiro Mori(AIST) / Nobuaki Kobayashi(Nihon Univ.) / Tetsuya Hirose(Osaka Univ.) / Koji Nii(Floadia) / Takeshi Kuboki(Kyushu Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials / Technical Committee on Integrated Circuits and Devices / Technical Group on Information Sensing Technologies |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Ultrafast Photonics Packaging using Room Temperature Bonding |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Ryo Takigawa |
| 1st Author's Affiliation | Kyushu University(Kyushu Univ.) |
| Date | 2019-08-07 |
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| Volume (vol) | vol.119 |
| Number (no) | SDM-161,ICD-162 |
| Page | pp.pp.-(), |
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